Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC ES2GHE3-LTP ES2GHE3
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- MCC ES2GHE3-LTP
- Type
- MCC
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- ES2GHE3-LTP
- Electronic Component
- 1
- Package
- DO-214AC(SMA)
- Electronic Component
- Switch Diode
- Electronic Component
- 0.107g
- Electronic Component
- 1
- Electronic Component
- BM0264353703
- Current
- 2A
- Current(Ir)
- 5uA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage Rating(Vr)
- 400V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES2GHE3-LTP 产品概述
一、产品简介
ES2GHE3-LTP 是美微科（MCC）推出的一款整流二极管，封装为 DO-214AC（SMA），适用于中等功率、高反向电压场合。核心电气参数为整流电流 2A、直流反向耐压（Vr）400V、反向电流（Ir）5μA，工作结温范围为 -55℃ 至 +150℃。该器件兼顾体积小、耐压高与可靠性，适合作为整流、保护与续流元件使用。
二、主要特性
- 标称整流电流：2A（连续工作条件下的典型额定值，设计时应考虑散热和热迁移）。
- 高耐压：Vr = 400V，适合高压整流与半波/全波整流电路。
- 低反向漏电：Ir = 5μA（在额定耐压下的典型反向漏电），利于减少待机能耗与提高系统稳定性。
- 宽工作温度：-55℃～+150℃，适应工业级温度范围。
- 封装：DO-214AC（SMA），便于自动贴片与波峰/回流焊，适合表面贴装工艺。
三、典型应用场景
- 开关电源二次侧整流、整流桥单元替换。
- 适配器、充电器及功率模块中的高压整流与保护。
- 直流电源接口的极性保护与反接保护。
- 马达驱动、继电器驱动电路中的续流二极管（需根据电压和电流条件确认）。
- 工业控制、照明电源及家电控制板等场景。
四、设计与使用建议
- 散热与余量：器件额定 2A 为在良好散热条件下的连续值，实际设计应通过增加铜箔面积、使用散热岛或降低环境温度来保证结温不超过规格。建议按环境和PCB热阻进行电流降额。
- 漏电随温升增加：反向漏电会随着结温升高显著上升，若工作在高温或高阻抗待机场景，应验证高温下的漏电表现。
- 冲击与浪涌：高电流浪涌（如开机浪涌、雷击）可能超过常态额定，设计时应参考完整数据手册中峰值脉冲电流和热失效限值，并考虑浪涌抑制元件。
- 焊接与安装：遵循 DO-214AC 的焊接工艺规范，保证焊点充分润湿和机械强度，避免过热导致封装或内部损伤。回流焊温度曲线以元件供应商推荐为准。
五、可靠性与检测要点
- 在出货前进行最大耐压、反向漏电、正向压降与热循环测试以验证一致性。
- 长期高温工作需关注正向压降漂移与漏电增大，建议在样机验证阶段进行高温寿命试验。
- 对关键应用可要求供应商提供批次报告或可靠性测试记录。
六、采购与资料
选购时请向 MCC 或授权分销商索取完整数据手册（Datasheet），以获取正向压降、峰值反向恢复、脉冲承受能力、热阻（RθJA/RθJC）及封装尺寸图等详细参数。对于量产应用，建议进行样品评估与可靠性验证后再确定最终型号。
如需我帮忙整理该型号的关键电气特性表、封装尺寸图或设计示例电路，请告知。
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