Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC SM5819L2-TP SM5819L2
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC SM5819L2-TP
- Type
- MCC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- SM5819L2-TP
- Electronic Component
- 1
- Package
- DFN-1006-2
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.018g
- Electronic Component
- 1
- Electronic Component
- BM0226522889
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 60uA@40V
- (Vf)
- 600mV@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SM5819L2-TP 产品概述
一、产品简介
SM5819L2-TP 为美微科（MCC）推出的一款表面贴装肖特基整流二极管，额定直流整流电流为1A，直流反向耐压（Vr）为40V，适用于对正向压降和开关速度有较高要求的小功率电源和便携式电子设备。器件采用 DFN-1006-2 小型封装，适配高密度 PCB 设计。
二、电气性能要点
- 正向压降（Vf）：典型 600mV @ 1A，有利于降低功率损耗与功率器件温升。
- 反向电流（Ir）：60µA @ 40V（标称条件），需在高温或高电压工况下关注漏电增加。
- 非重复峰值浪涌电流（Ifsm）：10A，可承受短时间的浪涌/充电冲击。
- 额定整流电流：1A，工作结温范围：-55℃ ~ +150℃，适合宽温应用环境。
三、封装与热管理
DFN-1006-2 封装体积小，有利于空间受限的设计，但热阻相对较高。设计时应注意：
- 在 PCB 侧增加散热铜箔和反水域，尽量扩大焊盘和热过孔以降低结到环境的热阻。
- 按照典型回路功耗 Pd ≈ If × Vf 估算，1A 工作下约 0.6W 的耗散，需要合理的散热路径和降额设计。
- 推荐使用无铅回流焊工艺，参考 JEDEC/IPC 标准回流曲线进行焊接，以保证焊点可靠性。
四、典型应用场景
- 开关电源输入整流与续流保护（降压/升压 DC-DC）。
- 便携式设备与电池管理中的续流或防反接保护。
- 快速开关与低压差整流场合，需兼顾低正向压降与低反向恢复时间的电路。
五、可靠性与选型建议
- 反向泄漏随温度上升明显增加，在高温工作环境下应预留足够裕量或选择更高 Vr/更低 Ir 的器件。
- 当系统可能出现频繁冲击电流时，应核算 Ifsm 与峰值能量，以免超过器件极限。
- 如需符合特定认证（如 AEC-Q、RoHS 等），请在选型前核实厂方数据手册与检测报告。
六、采购与资料
器件型号：SM5819L2-TP；品牌：MCC（美微科）；封装：DFN-1006-2。建议在设计和采购前获取并仔细阅读厂方完整版数据手册与封装尺寸图，以确认焊盘布局、热性能和可靠性参数满足项目需求。
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