Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
一、产品简介
MMSZ5245B-TP是一款高性能的稳压二极管,具备15V的标称齐纳电压,最大功率为500mW,适合于各种电压稳压及过压保护应用。该二极管的设计兼顾了高精度和优良的电气特性,能够在-55°C至150°C的宽温度范围下稳定工作。其紧凑的SOD-123封装形式,适合表面贴装技术的广泛应用,特别是在现代电子产品的小型化和高密度集成趋势下,MMSZ5245B-TP能够有效满足用户的需求。
二、电气参数
最大功率:MMSZ5245B-TP的最大功率为500mW,能够在负载变化时保持优良的稳定性。
标称齐纳电压(Vz):15V,确保在规定的条件下,稳压能够保持在这个值,有效保护后级电路。
精度与容差:精度为±5%,容差亦为±5%,在电力系统中可提供可靠的电压参考。
反向漏电流:在11V时,反向漏电流为100nA,性能优良,可有效降低功耗。
正向电压(Vf):在10mA的条件下,正向电压为900mV,说明该器件在正向工作时的低电压降特性。
阻抗:最大阻抗为16Ω,良好的动态响应能力。
三、应用领域
MMSZ5245B-TP被广泛应用于各类电子设备,例如:
电源电子设备:用于稳压电源、电流保护等,确保设备在不同工作条件下稳定运行。
消费电子产品:如手机、平板等移动设备,对电压的稳定性要求极高,MMSZ5245B-TP能够满足此需求。
通讯设备:在各种通讯模块中作为稳压器件,保护电路不受电压波动影响。
汽车电子:在汽车控制系统中,确保传感器和控制模块在异常电压情况下正常工作。
四、优点总结
高效能:凭借其500mW的功率和优异的漏电流特性,MMSZ5245B-TP在各种应用中能提供高效的电压保护。
广泛的温度范围:-55°C至150°C的工作温度,使其在极端环境条件下也能稳定工作,有效保证器件的可靠性。
小型封装:SOD-123封装适应现代电子产品的设计需求,使其在空间受限的情况下仍然能够得到良好的性能。
优良的动态性能:低阻抗和低泄漏电流特性使得该器件在各种动态负载下表现出极佳的稳定性和可靠性。
五、结论
总之,MMSZ5245B-TP稳压二极管是一款性能优异的器件,凭借其高精度、良好温度稳定性以及紧凑的封装形式,适用于多种应用场景。无论是在电源管理还是在信号保护领域,该器件都能为设计工程师提供一个可靠的解决方案,是现代电子设备中非常重要的元器件。选择MMSZ5245B-TP,便是选择了高效率和高可靠性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products