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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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BC847C-TP 是一款由美微科 (MCC) 生产的高性能 NPN 型晶体管,广泛应用于多种电子电路中,例如开关、放大器和小信号处理电路。这款晶体管以其优异的性能特点,成为了设计工程师在模拟和数字电路中常用的元器件之一。
BC847C-TP 的最大集电极电流 (Ic) 为 100mA,适合用于中小功率的应用场景。它的集射极击穿电压 (Vceo) 达到 45V,这使得它能够承受相对较高的电压,适合用于多种电源电压下的电路设计。此外,晶体管的饱和压降在不同的基极电流 (Ib) 情况下分别为 500mV,特别是在 5mA 和 100mA 的条件下,可以有效降低功耗并提高效率。
在低电流状态下,BC847C-TP 的集电极截止电流 (Icbo) 最大仅为 100nA,这表明在关断状态下该晶体管的漏电流非常微小,有助于提高电路效率,尤其适用于高精度测量和低功耗应用。
该晶体管的直流电流增益 (hFE) 也表现出色,在 2mA 电流和 5V 工作条件下,最小增益可达到 420,这意味着即使在较低的基极电流输入下,也能实现良好的集电极电流输出能力,从而使得其在放大特性上具备较高的灵活性。
BC847C-TP 的跃迁频率为 100MHz,表明其在高频信号处理中的能力。这样的性能使其适合用于 RF 电路、调制解调器和其他高频通信设备,为设计师提供了在不同频率范围内广泛应用的可能。
该晶体管支持宽广的工作温度范围,从 -55°C 到 150°C (TJ),确保它在极端气候条件下也能稳定工作。这一特性使得 BC847C-TP 在汽车电子和军事航天等领域尤其受欢迎,这些领域对温度的要求非常苛刻。
BC847C-TP 采用 SOT-23 表面贴装封装(TO-236-3,SC-59),这种小型化的设计使得其在空间受限的电路板设计中表现出色。表面贴装技术(SMT)也使得生产效率提高,便于大规模集成和自动化焊接,同时还能减少引线电感,提高电路的高频响应能力。
BC847C-TP 可广泛应用于各种电子设备中,包括但不限于:
BC847C-TP 是一款高性能的 NPN 型晶体管,凭借其优异的电气性能、宽广的工作温度范围和多种封装形式,使其在现代电子设计中具备广泛的应用潜力。作为专业设计人员,BC847C-TP 具有极高的性价比和灵活性,能够满足不同场合的设计需求,值得在多种项目中考虑选用。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
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When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
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The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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