WMSIC Electronic Components

MCC BZX84C13HE3-TP BZX84C13HE3

ModelBZX84C13HE3-TP
PackageSOT-23
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC BZX84C13HE3-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
BZX84C13HE3-TP
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.032g
Electronic Component
1
(Zzk)
170Ω
(Zzt)
30Ω
Electronic Component
BM0264862565
Diode
1
Current(Ir)
100nA@8V
Power Dissipation(Pd)
350mW
Electronic Component
12.4V~14.1V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84C13HE3-TP — 350mW 稳压(齐纳)二极管产品概述

一、产品概述

BZX84C13HE3-TP 是美微科(MCC)推出的一款低功耗、单体独立式稳压二极管,标称稳压值为 13V,精度 ±5%。该器件以 SOT-23 小封装提供,适用于空间受限且要求低漏电、低功耗的稳压参考与过压保护场合。器件工作结温范围宽(-55℃ 至 +150℃),可在多种环境下长期工作。

二、主要参数

  • 二极管数量:1 个(独立式)
  • 稳压值(标称):13V
  • 稳压值范围:12.4V ~ 14.1V(±5%)
  • 反向电流 Ir:100nA @ 8V
  • 最大耗散功率 Pd:350mW(在标准环境条件下)
  • 阻抗 Zzt:30Ω
  • 斜率阻抗 Zzk:170Ω
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SOT-23

三、特点与优势

  • 小封装、低占板面积:SOT-23 封装适合便携设备与高密度 PCB 布局。
  • 低反向漏电流:在 8V 条件下 Ir 仅为 100nA,适合对静态功耗敏感的电路(如电池供电设备)。
  • 宽温度范围:适用于工业级温度环境及较严苛的应用。
  • 稳压精度 ±5%:在多数一般稳压、基准与保护应用中提供足够精确度。
  • 可靠的过压保护与参考:适合用作局部基准源或电压钳位器件。

四、典型应用

  • 低功耗便携设备的局部稳压与基准来源
  • 模数转换(ADC)或采样电路的参考电压源(低电流条件)
  • 电池管理与便携式供电系统的过压钳制
  • 通信设备、消费电子与工业控制可替代高功耗线性稳压器的低功耗段
  • 信号调理与保护电路

五、设计与使用建议

  • 功率与热管理:器件额定耗散功率为 350mW,在实际电路中应进行 derating(随环境温度升高降低允许耗散)。在高环境温度或持续较大电流条件下,建议减小稳压管承受的功耗或改善散热(增大铜箔面积、缩短走线等)。
  • 工作点选择:齐纳二极管在低功率条件下有较大的动态阻抗,建议在目标稳压点附近工作于能够保证稳压性能的电流范围。对于要求更低纹波与更高稳定度的应用,可配合小信号电容或串联电阻优化响应。
  • 漏电影响:在极低电流测量或高阻输入场合,100nA 的反向电流可能影响电路偏置,应在设计时考虑漏电路径与隔离。
  • 对应偏置电阻:选择串联限流电阻时,应考虑稳压电流、器件最大耗散及电源电压余量,确保在任何工作状态下不超过 Pd。
  • PCB 布局:SOT-23 封装应保证良好焊盘与热铜,避免长窄走线导致额外温升或寄生电阻。

六、封装与可靠性

BZX84C13HE3-TP 提供 SOT-23 表面贴装封装,便于自动贴片与回流焊工艺。工作结温范围覆盖工业级温区(-55℃ 至 +150℃),适合长期使用。建议在焊接与回流过程中遵循制造商的温度曲线以保证可靠性。

七、采购与替代建议

  • 型号全称:BZX84C13HE3-TP(MCC)
  • 适用场景广泛,若需更高精度或更高功率,可考虑更高额定功耗或低阻抗型号;若需更小漏电、更稳定参考,可选专用基准源(参考电压芯片)替代。

总结:BZX84C13HE3-TP 是一款针对低功耗、小尺寸应用优化的 13V 齐纳稳压二极管,兼顾低漏电与宽温度性能,适合做局部稳压、过压钳位与参考用途。在实际应用中应注意功率耗散与热管理以确保长期稳定运行。

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