WMSIC Electronic Components

MCC SMBJ20A-TP SMBJ20A

ModelSMBJ20A-TP
PackageSMB(DO-214AA)
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC SMBJ20A-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
SMBJ20A-TP
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.212g
Electronic Component
1
Electronic Component
BM0264208958
Operating Temperature
55℃~+175℃
Voltage
32.4V
Current(Ir)
1uA
Voltage(VBR)
24.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ20A-TP TVS二极管产品概述

一、产品基本属性

SMBJ20A-TP是一款单向瞬态抑制二极管(TVS),由美微科(MCC)公司研发生产,采用SMB封装(DO-214AA),属于标准表面贴装型器件。作为电路过压防护的核心元件,其核心作用是在遭遇瞬态浪涌(如雷击、静电放电、开关干扰)时快速响应,将电压钳位在安全范围内,避免后端敏感元器件(如MCU、传感器)损坏。

二、核心电性能参数

该产品的关键参数直接决定防护能力,具体特性如下:

  1. 反向截止电压(Vrwm):20V
    即电路正常工作时,器件可长期承受的最大反向电压,适配12V、15V等低压系统(如车载12V电源、消费电子充电电路)。
  2. 击穿电压(Vbr):典型值24.5V
    反向击穿的起始电压,保证浪涌初期快速导通,避免电压延迟上升对电路的冲击。
  3. 钳位电压(Vc):32.4V(@18.5A峰值脉冲)
    脉冲峰值时器件两端的电压,可将过压限制在安全区间(远低于后端器件的耐压值)。
  4. 峰值脉冲能力:18.5A(Ipp,10/1000μs波形)、600W(Ppp)
    可应对常见的瞬态干扰(如IEC 61000-4-5浪涌测试、ESD静电放电),覆盖多数应用场景的防护需求。
  5. 反向漏电流(Ir):1μA(@20V反向电压)
    漏电流极低,正常工作时对电路功耗影响可忽略,适合电池供电的便携设备。
  6. 工作温度范围:-55℃~+175℃
    覆盖工业级、汽车级的严苛环境(如户外传感器、车载模块),无需额外降额设计。

三、封装与物理特性

SMB(DO-214AA)封装是TVS器件的主流表面贴装方案,具有以下优势:

  • 体积小巧:尺寸约3.5mm×2.5mm×1.5mm,适配高密度PCB设计(如智能手机、车载中控模块);
  • 贴装兼容:支持回流焊、波峰焊等常规工艺,生产效率高;
  • 极性清晰:封装表面通常有颜色带或引脚标识,便于区分阳极/阴极,避免反向安装失效;
  • 散热适配:虽为小型封装,但结合脉冲功率特性,可满足多数低压电路的瞬态散热需求。

四、品牌与可靠性说明

美微科(MCC)作为专业半导体厂商,SMBJ20A-TP的可靠性设计体现在:

  • 宽温验证:通过高低温循环、温度冲击测试,确保-55℃~+175℃范围内性能稳定;
  • 低功耗设计:1μA漏电流减少了长期工作的能量损耗,延长电池设备续航;
  • 脉冲能力认证:600W峰值功率符合国际浪涌测试标准,可有效防护典型瞬态干扰。

五、典型应用领域

结合参数与特性,该产品广泛应用于以下场景:

  1. 汽车电子:车载传感器(胎压监测、摄像头)、中控系统、12V电源模块的过压防护;
  2. 消费电子:智能手机、平板、蓝牙耳机的充电接口(USB/Type-C)、数据端口的ESD防护;
  3. 工业控制:PLC模块、传感器节点、电机驱动电路的瞬态抑制(应对开关浪涌);
  4. 通信设备:路由器、交换机的以太网端口、射频接口的过压保护;
  5. 低压电源:12V/24V电源输出端的浪涌防护(防止负载切换尖峰)。

总结

SMBJ20A-TP凭借单向防护、宽温范围、高脉冲能力与小型封装,成为低压电路过压保护的高性价比选择,适用于从消费电子到汽车工业的多领域应用,可有效提升电路的抗干扰可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.