Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC BAT54CT-TP BAT54CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC BAT54CT-TP
- Type
- MCC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- BAT54CT-TP
- Electronic Component
- 1
- Package
- SOT-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.287g
- Electronic Component
- 1
- Electronic Component
- BM0264254885
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 1V@100mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54CT-TP 产品概述
一、概述
BAT54CT-TP（MCC 美微科）为一对共阴极肖特基二极管，采用超小型 SOT-523 封装，适用于对体积和响应速度有严格要求的便携式与高频电路。器件以低正向压降和较小反向漏电为设计目标，提供稳健的整流与保护性能，适合微功率整流、信号钳位与反向保护场景。
二、主要参数
- 二极管配置：1 对共阴极（双路阳极、公共阴极）
- 正向压降 Vf：1.0 V @ IF = 100 mA
- 直流反向耐压 Vr：30 V
- 最大整流电流 IF(AV)：200 mA
- 反向漏电流 Ir：2 μA @ VR = 25 V（常温）
- 封装：SOT-523（超小型，3 引脚）
三、封装与引脚
SOT-523-3 超小型封装，便于高密度贴片安装。引脚功能通常为：A1、A2 为两路阳极，K 为公共阴极（具体引脚定义与焊盘尺寸请参考官方封装图纸与 PCB 设计指南）。封装兼容自动贴装与回流焊工艺，适合大批量生产。
四、产品特点
- 低正向压降：在中小电流条件下有效减小功耗与发热，有利于延长电池供电系统续航。
- 低反向漏电：25 V 下仅数微安，适合对漏电敏感的电源保护与电平保持电路。
- 快速响应：肖特基结构带来低恢复时间，适合高频开关与脉冲应用。
- 小封装：SOT-523 节省 PCB 面积，适合便携、可穿戴产品及密集布局场景。
五、典型应用
- 低压整流与高频整流（小功率）
- 电源反向保护与电源取舍（OR-ing）
- 信号钳位、混合信号隔离与电平移位
- ESD/浪涌保护的预钳位元件
- 便携式设备、移动终端、消费电子与物联网模块中空间受限的保护与整流电路
六、使用建议与注意事项
- 考虑到正向压降为标称 1 V（100 mA），在高电流持续载流时请评估功耗与散热，必要时限制平均电流或采用并联/更大封装器件。
- 反向耐压为 30 V，如用于高压侧请留有足够裕量并避免超限瞬态。
- 封装体积小，焊盘热量有限，回流温度曲线请按厂商推荐执行以保证焊接可靠性。
- 关键应用建议查看完整数据手册（电气特性曲线、瞬态行为与热阻参数）并在目标环境下进行温升与寿命评估。
如需器件的封装图、焊盘推荐、完整电气参数表或样片申请信息，我可为您提供进一步资料或对比同类器件建议。
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