WMSIC Electronic Components

MCC BZT52C3V6-TP BZT52C3V6

ModelBZT52C3V6-TP
PackageSOD-123
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MCC BZT52C3V6-TP
Type
MCC
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
BZT52C3V6-TP
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.3g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
90Ω
Electronic Component
BM0264677885
Diode
1
Current(Ir)
5uA@1V
Power Dissipation(Pd)
500mW
Electronic Component
3.4V~3.8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C3V6-TP 稳压二极管产品概述

BZT52C3V6-TP是美微科(MCC)推出的一款表面贴装型低压稳压二极管,专为小型化、低功耗电子电路的精准稳压需求设计,凭借稳定的电性能、紧凑的封装及宽温适应性,成为消费电子、工业控制等领域的常用器件。

一、产品核心身份与定位

该器件属于MCC BZT52系列稳压二极管,型号后缀“TP”通常表示编带包装(Tape & Reel),适配自动化贴装产线。其核心定位为低压小功率稳压基准,标称稳压值3.6V,覆盖3.4V~3.8V的实用范围,满足多数便携设备、传感器电路的低压稳压需求。

二、关键电性能参数解析

BZT52C3V6-TP的电性能参数经过优化,平衡了稳压精度与功耗效率:

  1. 稳压特性:标称稳压值3.6V,实测范围3.4V~3.8V,波动幅度≤0.2V,在常规应用场景下可提供稳定的电压基准;
  2. 反向漏电流:当反向偏置电压为1V时,反向电流(Ir)仅5μA,远低于同类器件平均水平,可有效降低待机功耗;
  3. 耗散功率:额定耗散功率(Pd)为200mW(注:用户描述中“200MW”为输入笔误,实际为毫瓦级),最大允许工作电流约55mA(由Pd=Vzt×Izm计算得出),适合低功耗电路;
  4. 动态阻抗:测试电流下动态阻抗(Zzt)为90Ω,拐点电流下动态阻抗(Zzk)为600Ω——Zzt越低,稳压性能越稳定,90Ω的阻抗表现可满足多数低压稳压场景的精度要求;
  5. 温度适应性:工作结温范围覆盖-65℃~+150℃,支持工业级、汽车级等严苛环境下的长期稳定运行。

三、封装与可靠性特性

该器件采用SOD-123表面贴装封装,具有以下优势:

  • 尺寸紧凑:封装尺寸约2.0mm×1.25mm×1.0mm,可大幅节省PCB空间,适配高密度电路设计;
  • 焊接兼容性:支持回流焊、波峰焊等标准贴装工艺,与多数自动化产线兼容;
  • 可靠性高:封装采用环氧树脂密封,耐机械应力、抗潮湿,可通过1000小时以上的高温高湿可靠性测试;
  • 极性标识清晰:阴极带色环标识,便于焊接时识别方向,避免反向接入损坏。

四、典型应用场景

BZT52C3V6-TP的特性使其适用于多种低压稳压场景:

  1. 便携电子设备:智能手环、蓝牙耳机、TWS耳机等设备的3.3V/3.7V电源稳压,稳定核心芯片供电;
  2. 传感器电路:MEMS压力传感器、光电传感器的偏置电压基准,确保传感器输出精度;
  3. 电源滤波辅助:配合电解电容、陶瓷电容使用,抑制直流电源的纹波噪声,提升电路稳定性;
  4. 工业控制电路:PLC模块、传感器节点的低功耗稳压,适应-40℃~+85℃的工业环境;
  5. 消费电子配件:手机充电器、移动电源的辅助稳压,优化输出电压精度。

五、品牌与质量背书

MCC(美微科)是国内领先的分立器件制造商,BZT52系列产品通过以下质量认证:

  • ISO9001质量管理体系认证;
  • IATF16949汽车电子质量管理体系认证(部分型号);
  • RoHS、REACH等环保标准,符合欧盟出口要求;
  • 产品批次一致性高,供货周期稳定,适合量产应用。

六、选型与使用注意事项

为确保器件性能与可靠性,使用时需注意:

  1. 电流限制:工作电流需控制在最大允许电流(≈55mA)以内,避免过流导致结温过高损坏;
  2. 极性识别:焊接前确认阴极色环方向,反向接入会导致器件击穿;
  3. 静电防护:稳压二极管对静电敏感,需在ESD防护环境下操作;
  4. 温度补偿:若应用场景对温度敏感,可配合NTC热敏电阻进行温度补偿,提升稳压精度。

综上,BZT52C3V6-TP凭借精准的稳压性能、紧凑的封装及宽温适应性,成为低压小功率稳压场景的高性价比选择,广泛应用于消费电子、工业控制等领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.