WMSIC Electronic Components

MCC BZT52B5V6-TP BZT52B5V6

ModelBZT52B5V6-TP
PackageSOD-123
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC BZT52B5V6-TP
Type
MCC
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
BZT52B5V6-TP
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.3g
Electronic Component
1
(Zzk)
400Ω
(Zzt)
40Ω
Electronic Component
BM0265866531
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
500mW
Electronic Component
5.49V~5.71V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52B5V6-TP稳压二极管产品概述

一、产品基本定位与核心身份

BZT52B5V6-TP是美微科(MCC)推出的小功率表面贴装稳压二极管,属于BZT52系列的典型型号。该器件核心功能是在反向击穿状态下提供稳定的5.6V电压输出,专为低功耗、高密度PCB布局的电路设计,适配便携式设备、工业控制、汽车电子等多场景需求。

二、关键电性能参数解析

该器件的核心参数直接决定其应用边界,具体解析如下:

  1. 稳压值与精度:标称稳压值5.6V,稳压范围覆盖5.49V~5.71V(公差±2%),属于较高精度稳压管,可满足传感器信号调理、低噪声电源等对电压稳定性要求较高的场景;
  2. 反向漏电流(Ir):反向偏置1V时,漏电流仅100nA,远低于普通稳压管水平,有效降低待机功耗,适合电池供电的便携式设备;
  3. 耗散功率(Pd):最大耗散功率500mW,典型应用场景下约410mW,支持的最大工作电流约89mA(由(P=V×I)计算:(500mW÷5.6V≈89mA)),覆盖中小负载电流需求;
  4. 动态阻抗特性:测试电流下动态阻抗(Zzt)40Ω,拐点电流下阻抗(Zzk)400Ω,低动态阻抗意味着输出电压受负载变化影响小,稳压性能更稳定;
  5. 工作温度范围:工作结温覆盖**-55℃~+150℃**,支持极端温度环境(如工业现场、车载场景)的长期稳定工作。

三、封装与物理特性

BZT52B5V6-TP采用SOD-123封装,是主流小型化表面贴装封装,核心特性:

  • 尺寸紧凑:约1.6mm(长)×0.8mm(宽)×0.6mm(高),节省PCB空间,适配高密度布局;
  • 焊接兼容:支持回流焊、波峰焊等自动化生产工艺,焊接峰值温度≤260℃(符合无铅工艺要求);
  • 环保合规:采用无铅封装,满足RoHS、REACH等国际环保标准,无有害物质限制。

四、典型应用场景

结合参数特性,该器件的核心应用场景包括:

  1. 便携式电子设备:智能手机、智能手环、蓝牙耳机等,低漏电流降低待机功耗,小封装适配设备小型化;
  2. 工业控制电路:PLC模块、传感器接口、电机驱动辅助稳压,宽温范围适应工业现场温度波动(-20℃~+85℃);
  3. 汽车电子:车载传感器(如胎压监测)、仪表盘电路,宽温性能符合车载环境要求(-40℃~+125℃);
  4. 电源稳压系统:5V电源的辅助稳压(如将5.6V稳压后分压得到精准5V),或低噪声电源的参考电压源;
  5. 通信设备:路由器、交换机的信号调理电路,稳定参考电压提升信号传输质量。

五、产品优势总结

  1. 稳压精度高:±2%的稳压范围,满足大多数精准电压需求;
  2. 低功耗设计:100nA反向漏电流,适合电池供电场景;
  3. 宽温适应性:-55℃~+150℃工作结温,覆盖极端环境;
  4. 小体积封装:SOD-123封装节省PCB空间,适配小型化设计;
  5. 性能稳定:低动态阻抗,输出电压受负载影响小。

六、选型与使用注意事项

  1. 功耗限制:实际应用中需确保耗散功率≤500mW,避免过载损坏;
  2. 温度系数:该系列稳压管温度系数约±0.05%/℃,若需更高稳定性,可搭配补偿电路;
  3. 焊接工艺:回流焊峰值温度≤260℃,焊接时间≤30秒,避免损伤器件;
  4. 反向偏置:使用时需工作在反向击穿区(5.6V左右),正向导通时需限制电流(正向压降≈0.7V)。

该器件凭借精准稳压、低功耗、宽温适配等特性,成为小型化电路中稳压参考的优选方案,可有效提升电路稳定性与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.