WMSIC Electronic Components

MCC BC846BHE3-TP BC846BHE3

ModelBC846BHE3-TP
PackageSOT-23
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC BC846BHE3-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
BC846BHE3-TP
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0264862571
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC846BHE3-TP 产品概述

一、器件简介

BC846BHE3-TP 为 MCC(美微科)提供的一款通用 NPN 双极型晶体管,采用 SOT-23 小封装,适用于小信号放大与低功率开关场合。器件在 Ic=2mA、Vce=5V 时直流电流增益 hFE≈200,允许集电极电流最高 100mA,集射极击穿电压 Vceo=65V,器件特征频率 fT≈100MHz,兼具较高增益与较好高频响应。

二、关键参数

  • 晶体管类型:NPN(单个器件)
  • 最大集电极电流 Ic:100mA
  • 集射极击穿电压 Vceo:65V
  • 功耗 Pd:225mW(典型环境下)
  • 直流电流增益 hFE:200(2mA, 5V 条件下)
  • 特征频率 fT:100MHz(典型)
  • 集电极截止电流 Icbo:100nA(典型)
  • 集电极饱和电压 VCE(sat):约 500mV(典型)
  • 发射-基极击穿电压 Vebo:6V
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SOT-23
  • 品牌:MCC(美微科)
  • 数量:1 个 NPN 器件

三、性能与特点

  • 高 hFE:在小电流工作点下增益较高,适合前级放大及偏置电路。
  • 宽电压余量:65V 的 Vceo 支持较大电压余量,在直流电源和负载变化情况下更稳健。
  • 高频特性良好:fT≈100MHz,适合用于高频信号放大与快速开关。
  • 小型封装:SOT-23 方便高密度 PCB 设计与自动化贴装。
  • 宽温度范围:适应工业级温度需求,可靠性高。

四、典型应用场景

  • 小信号放大器、前置放大与音频前级
  • 逻辑驱动、低电流开关与电平转换
  • 高速脉冲信号放大与信号整形
  • 便携式与消费类电子中的小功率开关元件

五、使用建议与注意事项

  • 封装功耗 Pd 与 PCB 散热密切相关,使用时应在设计阶段做好铜箔散热,并考虑环境温度和器件结温限制,必要时按厂家手册进行功耗降额计算。
  • VCE(sat)≈500mV 为典型值,实际饱和电压与驱动基极电流、集电极电流有关,若用作开关应保证足够基极过驱动以降低饱和损耗。
  • 引脚排列与封装细节请以厂方数据手册为准,布局时注意最短线路及地回流路径以减少寄生。
  • 焊接遵循推荐回流曲线;避免长时间超温,防止器件老化。
  • 做静电防护(ESD),在装配与测试环节使用防静电措施。

六、选型及替代建议

在需要同类性能的替代品时,可参考 BC846 系列或其它通用 NPN 小信号晶体管,但选型时务必核对 Vceo、hFE、Ic、Pd 与封装,确保满足电路的极限与热管理要求。更多细节请参阅 MCC 官方数据手册与典型应用电路。

若需该型号的具体引脚定义、典型特性曲线和热阻参数,请提供购买需求或索取厂方技术资料以获得完整数据支持。

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