Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC ESDSB5V0D3BHE3-TP ESDSB5V0D3BHE3
Configuration
1 options
Configuration
Option 137378
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC ESDSB5V0D3BHE3-TP
- Type
- MCC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- ESDSB5V0D3BHE3-TP
- Electronic Component
- 1
- Package
- SOD-323
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 50pF
- Electronic Component
- BM0264862562
- Operating Temperature
- 55℃~+150℃
- Voltage
- 17V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 1uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ESDSB5V0D3BHE3-TP 产品概述
一、产品简介
ESDSB5V0D3BHE3-TP 是美微科（MCC）推出的一款汽车级双向（Bi‑Dir）瞬态电压抑制器（TVS），专为5V工作电压的敏感线缆和信号接口提供静电放电（ESD）及浪涌保护。器件通过AEC‑Q101认证，封装为2引脚SOD‑323小型封装并以卷带（T/R）形式提供，适配自动化贴片生产与空间受限的电路板布局。
二、主要性能参数
- 反向截止电压（Vrwm）：5V（适配典型5V系统）
- 钳位电压：17V（在规范8/20µs浪涌条件下测得）
- 峰值脉冲电流（Ipp）：24A @ 8/20µs
- 峰值脉冲功率（Ppp）：400W @ 8/20µs
- 反向漏电流（Ir）：典型 1µA（在 Vrwm 条件下）
- 结电容（Cj）：约 50pF（有利于高频信号完整性）
- 通道数：单路（双向工作）
- 工作温度范围：-55℃ ~ +150℃
- 抗静电标准：符合 IEC 61000‑4‑2 要求（ESD 抗扰度）
以上参数使该器件在保证低静态功耗的同时，能在短时高能攻击下有效钳制过电压，保护下游器件不被损坏。
三、封装与可靠性
SOD‑323 小封装占板面积小、引脚间距紧凑，适合空间受限的前端保护设计。器件通过 AEC‑Q101 认证，温度循环、机械应力、电气特性在汽车级环境下具备可靠性，工作温度覆盖汽用电子常见的极端工况，适合车载总线和车身电子前端的长期可靠应用。
四、典型应用场景
- 汽车电子：CAN/LIN 总线端口、传感器信号线、车载娱乐与信息系统接口的前端防护
- 电源与信号接口：USB 5V 数据/电源线、I/O 端口、低压供电总线的浪涌保护
- 工业电子：人机界面、控制信号线、现场总线等要求抗ESD/浪涌的场景
器件的双向特性便于保护两端可能出现正负极性瞬变的信号线。
五、PCB 布局与使用建议
- 将 TVS 器件尽量靠近受保护的连接器或信号引入点放置，最短的走线有助于降低剩余电感与钳位效率。
- 引脚焊盘设计应满足 SOD‑323 推荐封装尺寸，保证良好焊接与热散能力；批量波峰/回流焊工艺下推荐使用卷带供料（T/R）。
- 对于高速信号线，需关注结电容（约50pF）对信号完整性的影响，必要时在系统级做仿真或选择更低电容的保护方案。
- 在高能浪涌场合，可与串联阻抗或熔断器配合，提升整体保护性能并实现过流保护。
六、订购信息与注意事项
产品型号：ESDSB5V0D3BHE3‑TP，品牌：MCC（美微科），封装：SOD‑323，包装：T/R（卷带）。选型时请确认工作电压、钳位要求与系统允许的结电容，并根据最终应用确认是否需要单向或双向器件。若用于关键车载系统，建议参照厂商提供的完整数据手册进行热稳定性与浪涌测试验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
