WMSIC Electronic Components

MCC SI3139KE-TP SI3139KE

ModelSI3139KE-TP
PackageSOT-523
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC SI3139KE-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
SI3139KE-TP
Electronic Component
1
Package
SOT-523
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0096011708
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
150mW
Gate Voltage(Vgs)
±12V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI3139KE-TP 产品概述

概要

SI3139KE-TP 是一种由美微科(MCC)生产的场效应管(MOSFET),属于P沟道类型,适用于各种电子设备中的功率开关和控制应用。以下是对此产品的详细介绍。

基础参数

  • 安装类型: 表面贴装型(SMT),适合现代电子制造过程中的自动化装配。
  • 电流 - 连续漏极 (Id): 在25°C 时,连续工作条件下的最大漏极电流为660mA,满足中等功率应用的需求。
  • 技术: 采用金属氧化物半导体场效应管(MOSFET)技术,具有高效能、低损耗和快速开关特性。
  • 导通电阻 (Rds On): 在600mA、4.5V条件下,最大导通电阻为700毫欧,确保低能耗和高效能转换。
  • 栅源电压 (Vgs): 最大栅源电压为±12V,提供宽泛的驱动电压范围,适应不同控制信号的需求。
  • 驱动电压: 最大Rds On和最小Rds On均在4.5V驱动电压下实现,简化驱动电路设计。
  • 阈值电压 (Vgs(th)): 在250µA条件下,最大阈值电压为1.1V,确保低阈值操作,减少静态功耗。
  • 功率耗散: 最大功率耗散为150mW,适用于小型封装且高效能的应用场景。
  • 输入电容 (Ciss): 在6V条件下,最大输入电容为170pF,帮助设计师优化高频性能和稳定性。
  • FET 类型: P沟道MOSFET,常用于负载开关、电源管理和信号控制等领域。
  • 工作温度: 工作温度范围从-55°C到150°C(TJ),适用于极端环境下的应用。
  • 漏源电压 (Vdss): 最大漏源电压为20V,提供足够的耐压能力,满足多种电压级别的应用需求。

封装和品牌

  • 封装: 采用SOT-523封装,体积小巧,适合空间有限的现代电子产品设计。
  • 品牌: 由美微科(MCC)生产,保证了产品的质量和可靠性。

应用场景

SI3139KE-TP P沟道MOSFET广泛应用于以下领域:

电源管理

  • 在DC-DC转换器、电池管理系统和功率因数校正(PFC)电路中,作为高效能的开关元件。
  • 用于降压、升压和逆变电路,提高系统整体效率和可靠性。

驱动和控制

  • 在电机驱动、LED驱动和其他负载控制应用中,利用其快速开关和低导通电阻特性。
  • 作为信号控制和逻辑门电路中的关键组件,确保信号传输的准确性和速度。

通信设备

  • 在通信设备如基站、无线路由器等中,用于功率放大和信号处理。
  • 由于其小型化封装和低功耗特性,特别适合移动通信设备。

汽车电子

  • 在汽车电子系统中,如启动系统、照明系统等,提供高可靠性和耐久性的性能。
  • 满足汽车行业对高温、振动等严苛环境下的要求。

设计考虑

在使用SI3139KE-TP时,设计师需要考虑以下几点:

热管理

  • 由于最大功率耗散为150mW,需要确保PCB布局和散热设计能够有效地将热量散发,以避免过热问题。

驱动电路

  • 确保驱动电路能够提供稳定的4.5V栅源电压,以达到最佳的导通电阻和开关性能。

电容选择

  • 根据具体应用,选择合适的输入电容(Ciss)以优化高频性能和稳定性。

安装和测试

  • 遵循SOT-523封装的安装规范,确保表面贴装过程中的可靠性和一致性。

总结

SI3139KE-TP 是一种高性能、低功耗的P沟道MOSFET,适用于广泛的电子应用场景。其小型化封装、低导通电阻和宽泛的工作温度范围,使其成为现代电子设计中的理想选择。通过合理的设计和应用,这款MOSFET可以显著提高系统的效率、可靠性和整体性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.