WMSIC Electronic Components

MCC BAT42W-TP BAT42W

ModelBAT42W-TP
PackageSOD-123
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC BAT42W-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
BAT42W-TP
Electronic Component
1
Package
SOD-123
Electronic Component
Schottky Diode
Electronic Component
0.202g
Electronic Component
1
Electronic Component
BM0231049999
Current
200mA
Diode
1
Current(Ir)
500nA@25V
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT42W-TP 肖特基二极管产品概述

一、产品基础定位与身份

BAT42W-TP是美微科(MCC)推出的一款小功率肖特基势垒二极管,属于低正向压降、高速开关类器件,核心面向低电压、小电流场景的整流、续流及信号保护需求,适配高密度表面贴装设计的电子设备。

二、核心电气参数解析

该器件的关键性能参数精准匹配多数低功耗应用的核心要求,具体如下:

  1. 正向压降(Vf):在额定整流电流200mA下,正向压降为1V——相比部分传统硅二极管,这一数值可有效降低正向导通损耗,提升电路整体效率;
  2. 直流反向耐压(Vr):额定反向耐压30V,覆盖常见低电压系统(5V、12V电源)的反向电压需求,避免器件反向击穿;
  3. 额定整流电流(If):连续正向电流额定值200mA,是长期可靠工作的电流上限,需避免瞬时或长期过载;
  4. 反向漏电流(Ir):25V反向电压下漏电流仅500nA——极低漏电流可显著减少反向截止功耗,尤其适合对静态功耗敏感的便携式设备。

三、封装与物理特性

BAT42W-TP采用SOD-123表面贴装封装,具备以下实用特性:

  • 尺寸紧凑:典型尺寸为长2.9mm×宽1.6mm×高1.1mm,大幅节省PCB空间,适配小型化电子设备(如蓝牙耳机、智能手环);
  • 贴装兼容:引脚布局符合自动化贴装工艺,适合大规模生产中的高速贴装,降低制造成本;
  • 可靠性强:封装采用耐高温、抗机械应力材料,可承受常见焊接温度及环境应力,长期工作稳定性良好。

四、典型应用场景

结合参数特性,BAT42W-TP的核心应用场景包括:

  1. 低电压电源整流:5V/12V小型适配器、USB充电电路的小电流整流支路;
  2. 开关电源续流:高频开关电源(LED驱动、小型DC-DC转换器)的续流二极管,利用肖特基高速开关特性减少续流损耗;
  3. 便携式设备电路:手机、平板、智能穿戴的充电管理、信号钳位电路,满足小空间与低功耗需求;
  4. 信号保护:低电压信号链路的过压保护,30V耐压覆盖TTL/CMOS电平,低漏电流不影响信号完整性;
  5. 电池管理辅助:BMS(电池管理系统)的辅助电源整流、小电流检测路径,低损耗提升电池续航。

五、性能优势总结

BAT42W-TP的核心优势可概括为三点:

  1. 高效低耗:[email protected]正向压降+500nA@25V反向漏电流,双低特性显著降低电路功耗;
  2. 高速响应:肖特基基于多数载流子导电机理,无少数载流子存储效应,开关速度远快于普通硅二极管;
  3. 小型化适配:SOD-123封装满足高密度PCB设计,适配电子设备轻薄化趋势。

六、应用注意事项

为确保长期可靠工作,需注意以下要点:

  1. 裕量控制:反向电压控制在24V以内(留20%裕量),正向电流避免超过200mA;
  2. 散热设计:高密度贴装时预留散热空间,防止局部过热;
  3. 焊接规范:遵循SOD-123封装要求(回流焊温度≤260℃,时间≤10秒),避免虚焊或热损伤。

该器件凭借平衡的性能与封装优势,成为低电压小电流场景的实用选择,广泛适配消费电子、工业控制等领域的小型化设计需求。

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