WMSIC Electronic Components

MCC MMSZ5252B-TP MMSZ5252B

ModelMMSZ5252B-TP
PackageSOD-123
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC MMSZ5252B-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
MMSZ5252B-TP
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.202g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
33Ω
Electronic Component
BM0264209511
Diode
1
Current(Ir)
100nA@18V
Power Dissipation(Pd)
500mW
Electronic Component
65℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMSZ5252B-TP 表面贴装齐纳二极管产品概述

一、产品基本定位与核心特性

MMSZ5252B-TP是MCC(美微科)推出的一款小功率表面贴装齐纳二极管,专为轻负载场景下的电压稳定需求设计。该器件以紧凑的SOD-123封装实现24V稳压功能,兼顾低功耗、高可靠性与易集成性,是各类小型电子设备稳压电路的常用选择。

二、关键电气参数详解

该器件的核心参数直接决定应用范围,具体解析如下:

  1. 稳压精度与范围:标称稳压值24V,公差±5%,实际稳压区间为22.8V~25.2V,无需额外校准即可覆盖常见轻负载波动,满足多数常规稳压需求;
  2. 反向漏电流:18V反向偏置下仅100nA(0.1μA),属于极低水平——非稳压状态下功耗可忽略,适合低功耗电路设计;
  3. 最大耗散功率:500mW(0.5W),明确负载能力上限(实际应用需结合散热留有余量,避免过载);
  4. 动态阻抗:稳压工作点附近Zzt为33Ω,反映稳压值随负载电流的变化灵敏度——33Ω的阻抗特性可保证负载电流小幅波动时,稳压值变化控制在合理范围。

三、封装与机械特性

采用SOD-123表面贴装封装,具备三大优势:

  • 尺寸紧凑:封装尺寸约1.6mm(长)×0.8mm(宽)×1.0mm(高),引脚间距0.6mm,大幅节省PCB空间,适合高密度电路;
  • 易焊接性:符合回流焊、波峰焊等自动化工艺要求,焊接兼容性好,适合量产;
  • 环保合规:满足RoHS、REACH标准,无铅无卤,符合绿色生产要求。

四、品牌与可靠性保障

作为MCC成熟产品,质量有可靠背书:

  • 品牌实力:MCC是国内半导体分立器件主流厂商,专注二极管、三极管研发生产超20年,产品覆盖消费电子、工业控制等领域;
  • 可靠性测试:经过温度循环(-55℃~150℃)、湿度测试(85℃/85%RH)、电应力老化等验证,符合JEDEC行业标准;
  • 供货稳定:标准化生产流程,批量供货周期可控,适合量产项目长期采购。

五、典型应用场景

结合参数特性,常见应用包括:

  1. 小型电源稳压:5V/12V开关电源次级稳压、智能手环等低功耗设备基准电压源;
  2. 传感器偏置稳压:压力/温度传感器的24V偏置电压,低漏电流避免干扰传感器信号;
  3. 通信模块辅助稳压:射频电路、蓝牙模块的小信号稳压,紧凑封装适配模块高密度布局;
  4. 消费电子过压保护:手机充电电路、耳机接口的过压防护,配合电阻构成保护回路;
  5. 工业控制稳压:PLC辅助电路、小型继电器控制电路的稳压,满足工业级温度范围。

六、选型与使用注意事项

实际应用需注意:

  • 负载电流限制:稳压工作时负载电流上限约20mA(24V×20mA=0.48W,留有余量),避免过热;
  • 散热设计:SOD-123封装建议焊盘尺寸≥1.2mm×0.6mm,保证散热;
  • 精度优化:若需更高精度,可筛选±5%公差范围内的器件,或增加外部滤波电容;
  • 反向偏置:避免长时间超24V反向偏置(如25V以上),防止漏电流增大。

该器件以平衡的性能与紧凑封装,成为小功率稳压场景的高性价比选择,适合从消费电子到工业控制的多领域应用。

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