WMSIC Electronic Components

MCC DFLZ5V6-TP DFLZ5V6

ModelDFLZ5V6-TP
PackageSOD-123FL
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 137396

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC DFLZ5V6-TP
Type
MCC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
DFLZ5V6-TP
Electronic Component
1
Electronic Component
±5%
Package
SOD-123FL
Electronic Component
Zener Diode
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0264353700
Type
Surface Mount
Operating Temperature
55°C ~ 150°C(TJ)
Power
1W
Electronic Component
Electronic Component
Electronic Component
2500
(Zzt)
5 Ohms

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DFLZ5V6-TP 产品概述

一、产品简介

DFLZ5V6-TP 是美微科(MCC)推出的一款表面贴装齐纳二极管,标称齐纳电压 Vz = 5.6V,额定功率 1W,容差 ±5%。封装为 SOD-123FL,适配现代 SMT 生产线,适用于需要稳定参考电压或低功耗过压保护的电子系统。

二、主要特点

  • 齐纳电压(标称):5.6V,容差 ±5%
  • 最大耗散功率:1W(铜箔和散热条件决定实际允许功率)
  • 工作结温范围:-55°C ~ 150°C(TJ)
  • 反向漏电流:10µA @ 2V(典型)
  • 正向压降:Vf = 1.2V @ If = 200mA
  • 动态阻抗(Zzt):≤5 Ω(最大值)
  • 封装:SOD-123FL,表面贴装,利于自动贴装与回流焊接

三、典型应用

  • 电源基准与基准源电路(小功率电压参考)
  • 信号线和电路板局部过压保护与钳位
  • 电源去耦与稳压补偿(低电流场合)
  • 工业控制、消费电子、通信模块的本地稳压与保护电路

四、设计与使用注意

  • 功率限制:长期工作时不得超过 1W,实际允许耗散受 PCB 散热能力影响;建议查阅完整器件热阻与 PCB 布局指导。
  • 工作电流选择:选择合适的偏流以保证 Vz 稳定,过低电流会使齐纳电压漂移,过大电流会导致过热。
  • 正向电流:若存在较大正向电流(如短路时),需评估 Vf 在 200mA 时约 1.2V 的压降与能量承受能力。
  • 温度影响:工作温度范围广,但在高温下漏电流与功率耗散能力会变化,应按实际环境留余量。

五、典型电路与示例

常见恒压电路为串联限流电阻 Rs 与齐纳并联负载。设计 Rs 可依据公式:Rs = (Vin - Vz) / Iz,其中 Iz 为预计通过齐纳的偏流(示例计算请以数据表中推荐条件为准)。在含有瞬态或大电流脉冲场合,应配合限流与热保护措施。

六、封装与装配

SOD-123FL 小型低高度封装,适合贴片机自动装配和标准回流焊工艺。推荐按厂家提供的 PCB 焊盘尺寸与回流曲线进行设计和焊接,以保证良好焊点与热散能力。适用于批量生产的卷盘式包装(Tape & Reel)。

七、可靠性与品质保障

器件按工业级温度规格测试,符合一般静态和热循环可靠性要求。为获得长期可靠性,应注意 PCB 散热设计与避免长期接近额定极限工作点。有关详细电气特性曲线、热阻和机械尺寸,请参考 MCC 官方规格书和器件数据手册。

如需样品、详细规格书或推荐 PCB 焊盘尺寸与回流曲线,可联系供应商或查询 MCC 官方文档获取完整技术资料。

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