Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBTA92-TP 是一款表面贴装型的 PNP 晶体管,采用小型 SOT-23 封装,专为多种电子应用场景设计。该晶体管由知名品牌 MCC(美微科)制造,具有出色的性能和可靠性,适合用于电源管理、信号放大以及开关电路等多种应用。
安装类型: MMBTA92-TP 采用表面贴装技术(SMD),这使得该器件可以被轻松地嵌入到现代电路板中,节省空间并提高生产效率。
晶体管类型: 这是一款 PNP 通用型双极晶体管,适合于多种放大和开关电路,在需要负载开关或信号反相时表现良好。
电流和功率: MMBTA92-TP 的最大集电极电流 (Ic) 为 300mA,允许在高电流应用中发挥作用。同时,其最大功率为 300mW,适用于中等功率的驱动场合。
电压特性: 该晶体管具备高达 300V 的集射极击穿电压(Vce),这意味着即使在电压较高的应用环境下也能可靠使用。
电流增益 (hFE): 在不同的工作条件下,MMBTA92-TP 具有最低 100 的直流电流增益(hFE)。在 10mA 的集电极电流和 10V 的 Vce 下,增益保持在一个相对稳定的水平,确保了稳健的信号放大性能。
频率响应: 其跃迁频率为 50MHz,因此可以在高频应用中有效运行,适合用于高频开关或放大应用。
温度范围: MMBTA92-TP 的工作温度范围为 -55°C 到 150°C,能够在极端环境下保持性能稳定,适合军事、航空航天和工业等恶劣条件下使用。
饱和压降: 在一定的基极电流 (Ib) 和集电极电流 (Ic) 下,饱和压降(Vce(sat))最大为 200mV,这意味着在开关应用中可以实现低损耗和高效率。
截止电流: 在无输入信号的情况下,该晶体管的集电极截止电流(ICBO)最大为 250nA,表明其有较低的漏电流特性,进一步提高可靠性。
MMBTA92-TP 的特性使其成为许多不同应用的理想选择,具体包括但不限于:
总的来说,MMBTA92-TP 是一款性能卓越、使用灵活的 PNP 晶体管,凭借其小型化设计和宽广的应用范围,成为了现代电子产品中不可或缺的组成部分。无论是在消费电子、工业设备还是高频通信领域,MMBTA92-TP 都能够提供可靠的性能和高效的解决方案,是工程师们设计电路时理想的选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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