WMSIC Electronic Components

MCC BC817-25W-TP BC817

ModelBC817-25W-TP
PackageSOT-323
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC BC817-25W-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
BC817-25W-TP
Electronic Component
1
Package
SOT-323
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0227689034
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC817-25W-TP 产品概述

一、概述

BC817-25W-TP 为一款通用型 NPN 双极结晶体管(BJT),由 MCC(美微科)出品,采用微小封装 SOT-323。器件面向小体积开关与低功耗放大应用,具有中等电流能力与较高频率特性,适合移动设备、便携电源管理与通用信号电路使用。

二、主要特性

  • 晶体管类型:NPN(硅材料,双极结型)
  • 集电极电流(Ic):最大 500 mA
  • 集—射极击穿电压(Vceo):45 V
  • 耗散功率(Pd):200 mW(封装热限制,实际应用需注意散热)
  • 特征频率(fT):约 100 MHz,适合低中频放大与开关应用
  • 集电极截止电流(Icbo):典型 100 nA(高阻态泄漏小)
  • 集—射极饱和电压(VCE(sat)):700 mV(在 500 mA 与 50 mA 两个工作点下的参考值)
  • 射—基极击穿电压(Vebo):5 V
  • 工作温度范围:-55 ℃ ~ +150 ℃

三、引脚与封装

封装为 SOT-323 微型塑料封装,适合高密度贴片电路。由于封装与引脚排列会受生产批次或PCB布局影响,实际焊盘与引脚定义请以厂商提供的完整规格书(datasheet)为准。

四、典型电气性能(关键参考)

  • 最大集电极电流 500 mA,但在接近最大电流时器件功耗迅速上升,受到 200 mW 耗散限制。
  • VCE(sat) 在高电流下可达 700 mV,作为开关器件时需考虑压降带来的功率损耗与系统电压余量。
  • fT ≈ 100 MHz,意味着在射频或高速放大器设计中有一定余地,但并非射频专用级别。

五、典型应用

  • 低压小电流开关(继电器驱动前置、LED 驱动低电流场合)
  • 通用信号放大器(前置放大、增益级等,频率至数十 MHz)
  • 电源管理辅助开关、负载选择与电平转换(需注意电压与功耗限制)
  • 便携式与空间受限设备中的替换或设计用器件

六、热与可靠性注意事项

  • SOT-323 封装的 200 mW 功耗限制要求在高 Ic 工作点下必须考虑脉冲工作或外部散热措施,尽量避免长期满载。
  • 禁止在基极与发射极之间施加超过 Vebo(5 V)的反向电压,以免损坏基区结构。
  • 长期工作在高温(接近 150 ℃)会加速参数漂移,推荐按实际应用余量设计温度与功率。

七、选型与使用建议

  • 若需长期驱动接近 500 mA 的负载,建议选择更高耗散能力或更大封装的器件;BC817-25W-TP 更适合间歇性或短时大电流脉冲应用。
  • 开关应用中按需要计算基极驱动电流:基极电流 Ib ≈ Ic / hFE_forced,设计时应保证驱动源能力并考虑器件最大基极电流限制。
  • 设计 PCB 时优化散热路径与铜箔面积,避免在狭小封装中产生局部过热。

八、包装与订购

  • 品牌:MCC(美微科)
  • 单位:1 个 NPN(按客户需求可做卷盘或托盘包装)
  • 其他详细封装尺寸、回流焊工艺与可靠性测试信息,请参考厂商完整数据手册以确保生产与使用的兼容性与可靠性。

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