WMSIC Electronic Components

MCC GBJ1506-BP GBJ1506

ModelGBJ1506-BP
PackageGBJ
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC GBJ1506-BP
Type
MCC
Minimum package
750 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
GBJ1506-BP
Electronic Component
1
Package
GBJ
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
9.628g
Electronic Component
1
Electronic Component
BM0263490660
Current
15A
Current(Ir)
10uA@600V
Electronic Component
55℃~+150℃@(Tj)
Electronic Component
Electronic Component
Electronic Component
750

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GBJ1506-BP 产品概述

一、产品简介

GBJ1506-BP(MCC 美微科)为单相桥式整流器,标准通孔GBJ封装,额定反向耐压600V。该器件设计用于通用整流场合,具备较低正向压降与较高浪涌承受能力,适合多种工业与消费类电源应用。

二、主要技术参数

  • 正向压降 (Vf):1V @ 7.5A
  • 直流反向耐压 (Vr):600V
  • 平均整流电流 (If):15A(整流)
  • 反向漏电流 (Ir):10μA @ 600V
  • 非重复峰值浪涌电流 (Ifsm):240A
  • 工作结温范围:-55℃ ~ +150℃
  • 类型:单相整流,通孔(GBJ)封装

三、特点与优势

  • 低正向压降:在中高电流工作点(7.5A)下Vf约1V,有助于降低整流损耗和发热。
  • 高耐压与低漏流:600V耐压配合10μA级漏电流,适合高电压工况且能保证较低静态损耗。
  • 强浪涌耐受:240A的峰值浪涌能力,使其能承受开机或短时过载冲击。
  • 宽温度范围:-55℃至+150℃的工作结温提高系统在严苛环境中的可靠性。
  • 通用GBJ通孔封装:便于手工焊接与传统波峰/回流焊接工艺,适配多种PCB布局。

四、典型应用场景

  • 开关电源整流输出与输入滤波桥
  • 工业控制电源、LED驱动电源、充电器与适配器
  • 家电、照明和电机驱动中的整流模块
  • 需要高耐压与抗浪涌能力的电源前端应用

五、安装与散热建议

  • 虽为通孔封装,仍需重视散热:在大电流或连续运行场合建议配合散热铜箔、热铜柱或外置散热片。
  • PCB布线应保证+、-端有足够的铜厚和过孔以降低热阻与导通阻抗。
  • 安装时避免临近高温器件,留出空气对流空间以利散热。
  • 遵循通用焊接工艺规范,避免过长期高温焊接造成器件损伤。

六、选型与使用注意事项

  • 若系统持续电流接近或超过15A,应选择更高额定电流器件或并联使用并做好均流设计。
  • 若追求更低整流损耗或高效率,可考虑低Vf的肖特基二极管,但需注意其耐压与反向漏流特性是否满足系统要求。
  • 在高海拔或高湿环境中应关注绝缘和散热,合理留有安全裕度。
  • 设计应考虑浪涌和瞬态过压保护(如压敏电阻或浪涌抑制器)以延长器件寿命。

七、包装与可靠性

GBJ封装适合通孔组装与批量生产,MCC品牌在可靠性测试与质量控制上具有良好记录。常见的包装形式便于自动化装配与库存管理。

如需完整的数据手册(正负极引脚定义、典型温度特性曲线、正向电阻与反向恢复特性等),建议索取厂家PCB封装图与详细规格书以完成最终电路设计与热仿真验证。

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