WMSIC Electronic Components

MCC GBU8J-BP GBU8J

ModelGBU8J-BP
PackageGBU
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC GBU8J-BP
Type
MCC
Minimum package
1000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
GBU8J-BP
Electronic Component
1
Package
GBU
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
4.1g
Electronic Component
1
Electronic Component
BM0263490878
Current
8A
Current(Ir)
5uA@600V
(Vf)
1V@4A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GBU8J-BP 产品概述

一、产品简介

GBU8J-BP 是美微科(MCC)生产的单相桥式整流器(GBU 封装)通孔器件,属于标准整流桥系列。该器件额定直流反向耐压 600V,平均整流电流 8A,适合中小功率开关电源、线性电源及工业电路的整流与续流应用。

二、主要电气参数

  • 型号:GBU8J-BP(GBU 封装,通孔)
  • 正向压降(Vf):1.0V @ 4A
  • 直流反向耐压(Vr):600V
  • 平均整流电流:8A(散热良好时)
  • 反向漏电流(Ir):5μA @ 600V
  • 非重复峰值浪涌电流(Ifsm):440A
  • 工作结温范围:-55℃ ~ +150℃
  • 类型:单相桥式整流器(四端:两个交流端、正极、负极)

三、产品特点与优势

  • 低正向压降:在高电流工作时可降低功率损耗与发热,提升整流效率。
  • 高耐压与低漏电流:600V 耐压与 5μA 的低反向电流,适合高压输入环境且减少待机损耗。
  • 强浪涌能力:440A 的峰值浪涌电流能够承受启动与短时冲击电流。
  • 宽工作温度范围:-55℃~150℃ 满足严苛工业环境要求。
  • 通孔 GBU 封装:便于手工焊接和机械固定,适配传统 PCB 与散热底座安装。

四、典型应用场景

  • 开关电源主整流或辅助整流
  • 线性电源整流与滤波段
  • 电机驱动与变频器前端整流
  • 工业控制与照明电源(含 LED 驱动)
  • 充电器、适配器及其他高电压整流场合

五、使用与散热建议

  • 工作电流接近额定值时需配合良好散热,包括采用散热片、铜质散热垫或保证充足气流。
  • 注意浪涌电流限制与重复脉冲应力,选择合适的输入限流或缓冲电路(NTC、限流电阻等)。
  • 封装为通孔类,焊接时遵循厂家推荐的温度曲线,避免长时间高温导致器件应力或封装损伤。
  • 设计时应留有安全裕量:耐压与正向压降在高温下会有变化,应按最坏工况选型。

六、选型与注意事项

  • 若工作环境存在更高瞬态电压或雷击脉冲,应考虑更高 Vr 或增加 TVS / MOV 抑制。
  • 对于高频开关应用,评估结电容与恢复特性是否满足系统要求。
  • 采购与替代:GBU 系列有多品牌同类产品,替代时需核对 Vf、Ir、Ifsm、热阻及封装脚位一致性。

如需完整电气特性曲线、封装尺寸或焊接规范,请参考 MCC(美微科)官方数据手册或向供应商索取样片与技术支持。

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