WMSIC Electronic Components

MCC RB521S-30DP-TP RB521S

ModelRB521S-30DP-TP
Package0201
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC RB521S-30DP-TP
Type
MCC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
RB521S-30DP-TP
Electronic Component
1
Package
0201
Electronic Component
Schottky Diode
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0264209498
Current
100mA
Diode
1
Current(Ir)
50uA@30V
(Vf)
800mV@100mA
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB521S-30DP-TP 产品概述

一、产品简介

RB521S-30DP-TP 为美微科(MCC)推出的一款肖特基整流二极管,采用极微小的0201表面贴装封装。器件额定直流整流电流为100mA,反向耐压30V,适用于对体积和重量有严格要求的便携式及高密度PCB应用。

二、主要电气参数

  • 正向压降 (Vf):0.8V @ 100mA
  • 直流反向耐压 (Vr):30V
  • 额定整流电流:100mA(DC)
  • 反向漏电流 (Ir):50µA @ 30V
  • 非重复峰值浪涌电流 (Ifsm):500mA
  • 工作结温范围:-55℃ ~ +125℃

三、关键优势

  • 极小封装(0201):适合超小型、超薄电子设备与高密度BGA底板的局部保护与整流应用。
  • 肖特基特性:典型的低正向压降与快速恢复特性,有利于降低功耗和提升开关效率(在100mA工况下Vf=0.8V)。
  • 宽温度范围:-55℃ 至 +125℃ 的结温范围适合工业级环境。

四、典型应用场景

  • 便携式与可穿戴设备的电源路径与反向保护
  • 智能传感器、物联网终端的功率整流与回路保护
  • 小信号整流、检测电路、混合信号前端的低电压降需求
  • 电源ORing与电池管理电路(在额定条件内)

五、封装与焊接注意事项

  • 0201 封装体积极小,热量扩散受限,长期或高平均电流使用时需注意热机理并进行电流降额。
  • PCB 布局应优化焊盘及热走线以改善散热,推荐在设计时参考厂商封装图与焊盘尺寸。
  • 焊接及贴装应由精密贴片机完成,回流焊工艺需控制温度曲线与时长,避免过热导致封装或性能退化。
  • 存储与处理应防潮、防静电,0201 器件易受机械应力影响。

六、设计与可靠性建议

  • 由于0201 封装热阻较大,建议在长期工作或连续大电流场景下将器件电流做合适降额;如需更高浪涌能力或更低Vf,考虑更大封装或并联方案。
  • 在高反向电压应用(接近30V)注意漏电流随温度上升而增加,必要时在电路中加入旁路或限流措施。
  • 进行可靠性验证时应覆盖高低温循环、湿热及焊接热循环等项目,确保在目标应用环境中满足寿命要求。

七、采购与替代

型号:RB521S-30DP-TP;品牌:MCC(美微科);封装:0201。
在选型时若需更低反向漏电、更低Vf或更高浪涌能力,可参考同类30V/100mA或更大电流评级的肖特基器件,并注意封装与散热差异对性能的影响。

如需器件详细的封装尺寸、回流曲线与完整电气参数表,请参考厂商Datasheet或联系供应商以获取官方技术支持。

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