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MCC SDB107-TP SDB107
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MCC SDB107-TP
- Type
- MCC
- Unit
- Electronic Component
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- SDB107-TP
- Electronic Component
- 1
- Package
- SDB-1
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.335g
- Electronic Component
- 1
- Electronic Component
- BM0000003064
- Current
- 1A
- Current(Ir)
- 10uA@1kV
- (Vf)
- 1.1V@1A
- Electronic Component
- 55℃~+150℃@(Ta）
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SDB107-TP 整流桥
一、基本信息
SDB107-TP 是由美微科（MCC）公司生产的一款高性能整流桥，旨在满足高压及高温应用环境中的电流整流需求。该器件采用表面贴装型（SMD）结构，易于集成到现代电子电路设计中，以节省空间并提高生产效率。SDB107-TP 具备优秀的电压及电流处理能力，适用于多种工业、电信及消费电子应用。
二、关键技术参数
电压规格：
- 峰值反向电压（VR）：SDB107-TP 的最大峰值反向电压为 1kV，使其能够在高压条件下可靠工作。
电流处理能力：
- 平均整流电流（Io）：器件支持的平均整流电流为 1A，这使其可以在多种负载条件下提供稳定的性能。
正向电压：
- 在 1A 的条件下，SDB107-TP 提供 1.1V 的正向电压（Vf），该低压降能够提高电路的整体能效，减少能量损耗。
反向泄漏电流：
- 在 1000V 的反向电压条件下，器件的反向泄漏电流为 10µA，显示出其良好的反向特性，这对于高压应用尤为关键。
环境温度适应性：
- SDB107-TP 的工作温度范围广泛，从 -55°C 到 +150°C，能够满足严苛环境条件中的可靠性需求。
三、封装与安装
SDB107-TP 采用 SDB-1 封装，具有小型化和轻量化的特点，适合表面贴装技术（SMT），使其能够在自动化生产线上高效装配。此外，SDB-1 封装还提供了良好的散热性能，以支持高温工作环境中持续运行。
四、应用场景
SDB107-TP 的设计使其适用于多种电子应用，包括但不限于：
- 直流电源电路：在各种电源转换器中可用作整流器，确保从交流到直流的转换高效且稳定。
- 高压设备：适合用于汽车电子、高压电源、变频器等领域中的电流整流。
- 工业控制设备：由于其宽广的工作温度范围，适合在极端环境下的工业自动化设备中使用。
- 通信设备：在信号处理和电源管理模块中，SDB107-TP 可用于确保稳定电流供应，从而提高设备的可靠性。
五、总结
SDB107-TP 整流桥以其卓越的电压和电流处理能力、优良的反向特性以及宽广的工作温度范围，成为高压应用及严格环境下的理想选择。美微科（MCC）在该产品设计上的技术优势，使得 SDB107-TP 具备了高效率、高可靠性的特性，满足现代电子设备对整流器的高要求。无论是在自动化、通信还是电源管理领域，SDB107-TP 都是工程师们在设计时值得考虑的重要元件。
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