WMSIC Electronic Components

MCC BZX84C33HE3-TP BZX84C33HE3

ModelBZX84C33HE3-TP
PackageSOT-23
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 137483

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC BZX84C33HE3-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
BZX84C33HE3-TP
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.032g
Electronic Component
1
(Zzk)
325Ω
(Zzt)
80Ω
Electronic Component
BM0264862575
Diode
1
Power Dissipation(Pd)
350mW
Electronic Component
31V~35V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84C33HE3-TP — 350mW 稳压二极管产品概述

一、产品简介

BZX84C33HE3-TP 是美微科(MCC)出品的一款低功耗独立式稳压二极管,封装为 SOT-23,额定耗散功率为 350mW。标称稳压值为 33V,允许公差 ±5%,因此实际稳压值范围为约 31V 至 35V。该器件适合用作高电压、小电流场合的基准或过压保护元件。

二、主要电气参数

  • 稳压值(标称):33V(公差 ±5%,范围 31V ~ 35V)
  • 最大耗散功率 Pd:350mW(环境及结温影响需降额)
  • 反向电流 Ir:100nA @ 23.1V(室温条件下)
  • 阻抗 Zzt:80Ω(测试点附近的动态阻抗,反映在工作区的电压变化对电流的敏感度)
  • 阻抗 Zzk:325Ω(在膝区的动态阻抗,低电流下电压稳定性较弱)
  • 工作结温范围:-55℃ ~ +150℃
  • 器件形式:单个独立稳压二极管,SOT-23 封装

三、性能与特点

  • 低漏电:在 23.1V 条件下反向电流仅 100nA,适合需要低泄漏的电路。
  • 中高压稳压:33V 标称电压适用于对供电或信号线进行较高电压的稳压或保护。
  • 小封装、低功耗:SOT-23 封装便于表面贴装,适合空间受限的设计,但受限于 350mW 的耗散能力。
  • 动态阻抗特性:Zzt 较低表明在规定测试电流附近电压保持较好;Zzk 较高提示在非常小的偏流时稳压性能下降,应避免长期工作在膝区。

四、典型应用场景

  • 参考电压源与基准电路(需与限流电阻配合使用)
  • 过压钳位与输入保护(低电流信号线路)
  • 小型电源模块的次级稳压或电压监测点
  • 工业/通信类器件的高电压偏置保护

五、使用建议与注意事项

  • 能量管理:按照 Pd = Vz × Iz 计算最大稳压电流。以 33V 为例,理论最大 Iz ≈ 0.35W / 33V ≈ 10.6mA,但推荐使用裕量(例如不超过额定的 50–70%)以延长寿命并降低结温。
  • 限流元件:在串联限流电阻或恒流源下使用,以保证不超过耗散上限。
  • 温度与漏流:漏电流随温度上升而增加,热沉与 PCB 散热设计对维持性能和可靠性至关重要。SOT-23 散热有限,注意环境温度与布局。
  • 工作区选择:避免长期在阻抗较高的膝区(对应 Zzk)运行,否则稳压精度会下降。
  • ESD 与焊接:遵循一般 SMD 器件的 ESD 防护与回流焊准则,避免高温暴露时间过长。

六、封装与物理特性

器件采用常见的 SOT-23 三引脚封装(实际只需两引脚使用,一个为焊盘或情形保留)。封装利于自动贴装和批量生产,但热阻较大,建议在 PCB 设计时为其提供适当的铜箔散热路径。

总结:BZX84C33HE3-TP 以其 33V 的中高稳压值、低漏电及小体积封装,适合用于空间受限、需低电流高电压稳压或保护的场合。在设计时应重视耗散功率限制、热管理与工作电流范围,配合合适的限流与 PCB 布局可发挥稳定可靠的性能。

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