Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC ER5D-TP ER5D
Configuration
1 options
Configuration
Option 137485
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC ER5D-TP
- Type
- MCC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- ER5D-TP
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Switch Diode
- Electronic Component
- 0.354g
- Electronic Component
- 1
- Electronic Component
- BM0264859733
- Current
- 5A
- Current(Ir)
- 5uA
- (Vf)
- 1V@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 200V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ER5D-TP 产品概述
一、产品简介
ER5D-TP 是美微科（MCC）推出的一款通用整流二极管，采用SMC（DO-214AB）封装，适用于中功率整流与逆向保护场合。器件在大电流条件下表现出较低的正向压降与极小的反向漏流，可靠性高、易于安装，适合工业与消费类电源设计。
二、主要电气参数
- 整流电流（IF）：5A（持续）
- 直流反向耐压（Vr）：200V
- 正向压降（Vf）：1.0V @ IF=5A
- 反向电流（Ir）：5µA（典型/最大，视测试条件而定）
- 工作结温范围：-55℃ ~ +150℃
三、产品特点
- 低正向压降：在额定整流电流下Vf约1V，降低导通损耗，有利于提升效率与减少发热。
- 低反向漏流：Ir仅数微安，有利于高阻态下的稳态性能和高压环境下的待机损耗控制。
- 宽温度范围：-55℃至+150℃的结温适应性，满足严苛环境和高温工作场景。
- 标准SMC封装：便于自动贴装与波峰/回流焊接，良好的散热能力与机械强度。
四、典型应用场景
- 开关电源（SMPS）整流输出或续流二极管
- 交流/直流电源模块、整流桥和电源滤波
- 电池充电器、车载电源及逆变器输入保护
- 逆向与浪涌保护电路中承担高压反向阻挡任务
五、设计与热管理建议
- 降额设计：在高环境温度或长期满载情况下，建议对整流电流进行适当降额以延长寿命并控制结温。
- 散热处理：虽然SMC有较好散热路径，但仍建议在PCB上增大焊盘铜箔、增加散热层或使用散热片与过孔导热，以降低结壳温差。
- 布局注意：避免在高温热源附近布置，同时留出足够的焊盘面积与走线宽度以减小接触电阻。
- 焊接工艺：可采用回流或波峰焊，遵循厂家推荐的温度曲线以保证产品可靠性。
六、包装与可靠性
ER5D-TP 采用行业标准封装，适合自动化贴装与后端加工。美微科具备完善的质量检验流程（包括温度循环、冲击和寿命测试），产品稳定性适合长期批量使用。订购时请参阅厂家规格书以获取完整的测试条件与曲线资料。
如需评估具体电路中的热耗、结温或替代型号建议，可提供电路工况与PCB布局以便进一步分析。
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