WMSIC Electronic Components

MCC SR5200-TP SR5200

ModelSR5200-TP
PackageDO-201AD
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC SR5200-TP
Type
MCC
Minimum package
1200 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
SR5200-TP
Electronic Component
1
Package
DO-201AD
Electronic Component
Schottky Diode
Electronic Component
1.441g
Electronic Component
1
Electronic Component
BM0265311954
Current
5A
Diode
1
Current(Ir)
10uA@200V
(Vf)
900mV@5A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1200

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SR5200-TP肖特基整流二极管产品概述

一、产品基本定位

SR5200-TP是美微科(MCC) 推出的轴向引线肖特基整流二极管,型号中“SR”代表肖特基整流(Schottky Rectifier),“5”对应持续整流电流5A,“200”对应直流反向耐压200V,封装为DO-201AD。作为中功率肖特基器件,其核心优势在于低导通损耗与高可靠性,适用于多种低压大电流整流场景。

二、核心参数详细说明

该器件的关键参数直接决定应用范围,具体如下:

  • 正向压降(Vf):900mV@5A(直流正向电流5A时的典型压降),远低于同电流等级普通硅整流管(如1N5408约1.2V@3A),可显著降低导通损耗;
  • 直流反向耐压(Vr):200V(额定反向截止电压,实际应用建议降额至160V以内);
  • 持续整流电流(If):5A(直流连续工作电流,DO-201AD封装可稳定承载);
  • 反向漏电流(Ir):10μA@200V(反向电压200V时的典型漏电流,漏电小则待机功耗低);
  • 工作结温范围:-65℃~+150℃(覆盖工业级温度要求,适应高低温环境);
  • 非重复峰值浪涌电流(Ifsm):150A(瞬间耐受大电流能力,应对开机、负载突变等冲击);
  • 封装:DO-201AD(轴向引线,插件式安装,散热面积适中,焊接方便)。

三、技术特性与优势

  1. 低损耗效率高:900mV的低正向压降可减少电源导通损耗,提升转换效率(尤其在低压大电流场景,损耗占比更显著);
  2. 宽温可靠性强:-65℃至150℃的结温范围,满足工控、户外等 harsh环境的温度要求;
  3. 抗浪涌能力突出:150A非重复浪涌电流,可有效抵御瞬间大电流冲击,降低系统故障风险;
  4. 低漏电待机优:10μA的反向漏电流,减少反向截止时的能量损耗,适合对待机功耗敏感的设备(如适配器、LED驱动);
  5. 成熟封装易应用:DO-201AD轴向封装引线牢固,无需特殊散热设计(小电流下),插件安装兼容传统PCB工艺。

四、典型应用场景

结合参数优势,SR5200-TP广泛适用于以下场景:

  • 中小功率开关电源:如5V/2A、12V/1.5A等输出的电源模块,替代传统硅整流管提升效率;
  • 消费电子适配器:手机、笔记本、平板等适配器的二次整流,降低发热并缩小电源体积;
  • 工业电源模块:工控设备、仪器仪表的辅助电源,适应宽温与振动环境;
  • LED驱动电源:低压大电流LED驱动的整流环节,减少损耗以提升LED亮度稳定性;
  • 车载辅助电源:(需确认车规认证)部分车载12V/24V辅助电源,利用宽温与抗浪涌特性。

五、使用注意事项

为确保器件可靠性,应用时需注意:

  1. 电流与电压降额:持续电流建议≤4A(20%裕量),反向电压≤160V(80%降额);
  2. 散热设计:若工作电流接近5A,需配合小型散热器(如TO-220封装散热器适配);
  3. 焊接规范:焊接温度≤260℃,持续时间≤5秒,避免损坏芯片;
  4. 浪涌防护:极端浪涌场景(如雷击)需额外增加TVS管等防护器件;
  5. 环境要求:避免长期暴露在高湿度、腐蚀性气体环境中,保持PCB清洁。

六、品牌与可靠性背书

美微科(MCC)作为国内功率器件龙头厂商,SR5200-TP经过严格可靠性测试(如高温反偏HTRB、温度循环TC、湿热测试THB等),符合RoHS环保标准,参数一致性好,适合批量生产应用。

总结:SR5200-TP是一款高性价比的肖特基整流二极管,以低损耗、宽温、强抗浪涌为核心竞争力,是替代传统硅整流管的理想选择,可满足多种中功率低压整流场景的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.