WMSIC Electronic Components

MCC MBRD1045C-TP MBRD1045C

ModelMBRD1045C-TP
PackageDPAK(TO-252)
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 137492

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC MBRD1045C-TP
Type
MCC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
MBRD1045C-TP
Electronic Component
1
Package
DPAK(TO-252)
Electronic Component
Schottky Diode
Electronic Component
0.458g
Electronic Component
1
Electronic Component
BM0264862561
Current
10A
Diode
1
Current(Ir)
100uA@45V
(Vf)
510mV@10A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MBRD1045C-TP 产品概述

一、产品简介

MBRD1045C-TP 是美微科(MCC)推出的一款单只独立式肖特基二极管/整流器,额定整流电流为 10A,反向耐压 45V,采用 DPAK(TO-252)表面贴装封装。凭借肖特基结构的低正向压降与快速恢复特性,适用于对效率和开关损耗敏感的电源与功率电路。

二、主要电气参数

  • 正向压降 (Vf):0.51 V @ 10 A(低压降可降低导通损耗)
  • 直流反向耐压 (Vr):45 V
  • 额定整流电流:10 A(连续)
  • 反向电流 (Ir):100 μA @ 45 V(常温)
  • 非重复峰值浪涌电流 (Ifsm):150 A(瞬态冲击能力强)
  • 工作结温范围:-55 ℃ ~ +150 ℃

三、性能特点与优势

  • 低正向压降:降低导通损耗与发热,有助于提高整体转换效率。
  • 快速恢复与低结电容:在开关电源和高频整流场合可减少开关损耗与电磁干扰(EMI)。
  • 良好浪涌承受能力:150A 峰值冲击支持启动或短时故障场景。
  • 宽工作温度范围:适应工业级环境与高温工作条件。

四、典型应用场景

  • 开关电源(SMPS)输出整流
  • DC-DC 转换器与功率模块
  • 车载电子的整流与反接保护(注意温度与封装散热)
  • 电机驱动的自由轮二极管、整流桥替代件
  • 太阳能逆变器、电池保护电路等需要低压降整流的场合

五、设计与选型建议

  • 封装为 DPAK(TO-252),需关注焊盘与散热铜箔面积以保证热阻可控,必要时并联或采用散热器。
  • 注意反向漏流随温度上升而增加,在高温或高偏压工况下应留有裕量。
  • 对持续大电流工况进行热仿真与结温估算,遵循器件最大结温限制。
  • 若应用在高频脉冲或反复浪涌场合,检查Ifsm与重复浪涌规范,必要时选择更高峰值能力的器件或并联使用。

六、封装与可靠性注意

DPAK 封装兼顾功率与表贴装配便利,适合自动化贴装生产。焊接时应遵循推荐的回流曲线,保证焊点可靠性;长期高温或频繁热循环环境下需评估焊接疲劳与热稳定性。

总结:MBRD1045C-TP 是一款面向中低压(≤45V)、高效率整流场合的 10A 肖特基二极管,凭借低 Vf、良好浪涌能力与 DPAK 封装,在电源与功率管理设计中具备良好性价比与实用性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.