WMSIC Electronic Components

MCC MMSS8550-L-TP MMSS8550

MCC MMSS8550-L-TP MMSS8550
1 / 3

Product image

ModelMMSS8550-L-TP
PackageSOT-23
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
MCC MMSS8550-L-TP
Type
MCC
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
MMSS8550-L-TP
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0000282956
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
100MHz
Power Dissipation(Pd)
625mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：MMSS8550-L-TP

1. 产品简介

MMSS8550-L-TP 是一款性能优良的PNP型晶体管，专为广泛的电子应用设计，包含高达625mW的额定功率和集电极电流（Ic）最高可达1.5A的特性。该晶体管采用流行的SOT-23封装，使其适用于表面贴装技术（SMT）装置，特别适合空间有限的应用场合。其设计保证了在广泛的工作温度范围内的稳定性，从而满足工业、通讯和消费电子等多种领域的需求。

2. 主要技术参数

  • 额定功率: 625mW
  • 集电极电流 (Ic): 1.5A（最大值）
  • 集射极击穿电压 (Vce): 25V（最大值）
  • 饱和压降 (Vce): 在80mA和800mA时，最大值为500mV
  • 集电极截止电流: 100nA（最大值）
  • 直流电流增益 (hFE): 最小值120 @ 100mA，1V
  • 频率 - 跃迁: 100MHz
  • 工作温度范围: -55°C 到 150°C
  • 封装类型: SOT-23（TO-236-3）表面贴装型

3. 应用领域

MMSS8550-L-TP可以广泛应用于以下领域：

  • 开关电路: 由于其较大的集电极电流及良好的饱和特性，适合用于开关电路中，如电源开关、继电器驱动等。
  • 放大电路: 其具有较高的直流电流增益，使其在小信号放大器应用时表现出色，能够有效放大微弱的电信号。
  • 射频应用: 具备高达100MHz的跃迁频率，支持多种射频（RF）应用，诸如RF开关、调制和频率转换等。
  • 便携式设备: 由于其小巧的SOT-23封装，MMSS8550-L-TP非常适合用于手机、便携式音频设备和其他消费类电子产品。

4. 设计考虑

在使用MMSS8550-L-TP时，设计师需要考虑以下因素：

  • 散热管理: 虽然该晶体管的额定功率为625mW，但在高电流工作条件下，应确保良好的散热设计以避免过热。
  • 工作环境: 产品的工作温度范围较广，但在极端条件下，高低温的应用可能会影响其性能，需要在设计中做相应的补偿。
  • 偏置电流设计: 为确保晶体管在其线性区域正常工作，特别是在放大应用中，需精确计算和设置基极电流（Ib）以维持适当的工作点。

5. 总结

MMSS8550-L-TP 是一款高性能的PNP型晶体管，适应范围广，能够在各类电子应用中提供出色的性能。其小型的SOT-23封装、优异的电流增益及频率响应特性，使其成为工程师和设计师在构造高效能电路时的理想选择。无论是在消费电子、工业控制，还是通信设备中，MMSS8550-L-TP都能帮助实现高效率和可靠性的设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.