Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC SI2302-TP SI2302
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MCC SI2302-TP
- Type
- MCC
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- SI2302-TP
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0266030360
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.25W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SI2302-TP N沟道MOSFET
一、基本信息
SI2302-TP是一款高性能的N沟道金属氧化物半导体场效应管（MOSFET），专为低电压和中等功率应用设计，具有理想的电气特性和紧凑的封装形式。封装类型为SOT-23，适合表面贴装，广泛应用于各种电子电路和设备中，如 DC-DC 转换器、开关电源、马达驱动等。
二、技术规格
漏源电压（Vdss）：20V SI2302-TP能够承受高达20V的漏源电压，适合在各种供电电压下运行。
连续漏极电流（Id）：3A 在25℃的环境温度下，该产品能够输出最大连续漏极电流为3A，确保了在负载电流变化时仍然能够稳定工作。
导通电阻（Rds(on)：72mΩ @ 3.6A, 4.5V 该MOSFET在3.6A的电流和4.5V的栅极电压下展现出72毫欧的导通电阻，意味着在开关状态时电能损耗非常低，极大提升了效率。
阈值电压（Vgs(th)：1.2V @ 50µA SI2302-TP的栅源极阈值电压为1.2V（在50µA下测量），确保了MOSFET在较低电压下即可开启，优化了电路设计时的驱动电压选择。
最大功率耗散：1.25W (Ta=25°C) SI2302-TP的最大功率耗散能力为1.25W，这使该器件可在较高功率下运行而不至于过热，为散热设计提供了灵活性。
工作温度范围：-55°C ~ 150°C 其工作温度范围广泛，适合高温环境下的应用需求，符合工业及汽车电子产品的标准。
驱动电压（Vgs）：最大 ±8V 它可以接受最大±8V的栅源电压，这使得SI2302-TP在多种驱动电路中使用都非常方便。
栅极电荷（Qg）：10nC @ 4.5V 该器件的栅极电荷为10nC，这使得其在高频应用中表现出色，快速开关操作减少了通道损耗。
输入电容（Ciss）：237pF @ 10V SI2302-TP的输入电容在10V时为237pF，较低的输入电容有助于提升开关速度，降低驱动功耗。
三、应用领域
由于其优良的电气性能，SI2302-TP在以下几个领域内有广泛应用：
- DC-DC转换器：高效能的功率开关能够降低转换损耗。
- 电池管理系统：适用于电池充放电控制，确保稳定的电流输出。
- 马达驱动：可用于直流电机的控制电路，提供稳定的电流支持。
- LED驱动器：适合用于LED电源和调光应用，提高能源利用率。
- 消费电子产品：如手机、平板等便携式设备中用于电源管理。
四、总结
SI2302-TP是一款具有高度集成性和优良性能的N沟道MOSFET，结合了出色的导电特性和紧凑的SOT-23封装，极其适合在现代电子设备中应用。其低导通电阻、高电流承载能力及宽温度范围，使其成为设计师在选择MOSFET时的理想选择。无论是用于功率转换、马达控制还是其他低功耗应用，SI2302-TP都将是一个值得信赖的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
