Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC BAT54WSHQ-TP BAT54WSHQ
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC BAT54WSHQ-TP
- Type
- MCC
- Minimum package
- 30000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- BAT54WSHQ-TP
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0265158987
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 1V@100mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 30000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54WSHQ-TP 产品概述
一、产品简介
BAT54WSHQ-TP 是美微科（MCC）出品的一款肖特基势垒整流二极管，采用 SOD-323 小型贴片封装，面向便携与高密度电路板设计场景。该器件提供低正向压降和快速整流特性，适合用于低电压、高频率和节能场合的整流与保护电路。
二、主要参数
- 二极管配置：1 个独立式
- 正向压降（Vf）：1 V @ 100 mA
- 直流反向耐压（Vr）：30 V
- 额定整流电流（If）：200 mA
- 反向电流（Ir）：2 μA @ 25 V
- 非重复峰值浪涌电流（Ifsm）：600 mA
- 工作结温范围：-55 ℃ ～ +150 ℃
- 封装：SOD-323
三、关键特性
- 低正向压降和肖特基特性：在中低电流条件下提供较低功耗的整流，利于延长电池供电设备的续航。
- 低反向泄漏：在常温和中等反向电压下泄漏电流较小，有助于降低静态功耗。
- 抗浪涌能力良好：600 mA 的瞬态浪涌能力满足短时启动和突发冲击场景。
- 宽工作温度范围：适应工业级温度需求，可靠性高。
四、典型应用
- 低压整流与电源二极管（小功率开关电源、受限空间电源模块）
- 电源反向保护与电源 OR-ing（多电源自动切换）
- 高频整流与脉冲整流场合
- 便携消费电子、物联网节点、传感器前端供电保护
五、封装与热管理
SOD-323 小封装有利于高密度布板与表面贴装工艺，但热阻相对较高。建议在高平均电流或连续工作时采取适当的降额使用或在 PCB 上增加铜箔散热区来改善热沉。焊接工艺应按片式封装的热曲线规范执行，避免超温损伤元件。
六、选型及使用建议
- 若系统工作电流接近或超过 200 mA，应考虑更大电流等级的肖特基器件或并联多片并注意均流问题。
- 在高温或高反向电压环境下，关注反向漏电随温度升高的增长，必要时增加热设计裕量。
- 在浪涌较大场合（如电机起动、感性负载退磁）应评估 Ifsm 是否满足实际冲击要求，或增加吸收元件以缓解冲击。
本产品以小型化、低损耗为特点，适合对空间与能耗敏感的中低功率电子系统。若需完整电气特性曲线、封装尺寸图或可靠性数据，请联系供应商索取器件数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
