WMSIC Electronic Components

MCC MCU15N10A-TP MCU15N10A

ModelMCU15N10A-TP
PackageDPAK
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC MCU15N10A-TP
Type
MCC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
MCU15N10A-TP
Electronic Component
1
Package
DPAK
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.511g
Electronic Component
1
Electronic Component
BM0264780375
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
50W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCU15N10A-TP N沟道MOSFET产品概述

一、核心身份与品牌背景

MCU15N10A-TP是美微科(MCC) 推出的单管N沟道增强型MOSFET,属于功率半导体器件范畴。MCC作为专注功率器件研发与生产的企业,产品覆盖工业控制、消费电子、汽车电子等领域,以高可靠性和性价比著称。该型号通过DPAK封装实现紧凑布局,核心参数匹配100V电压、15A电流的应用需求,是中低功率开关场景的常用器件。

二、关键电气参数解析

该器件的电气性能可从电压电流能力、导通损耗、开关特性、功率温度范围四个维度解析:

1. 电压与电流承载能力

  • 漏源击穿电压(Vdss):100V,即漏极与源极间的最大耐受电压,确保器件在100V以下电路安全工作;
  • 连续漏极电流(Id):25℃时最大连续电流为15A,是长期稳定工作的电流上限(随温度升高需降额);
  • 脉冲承载能力:虽未明确给出脉冲电流值,但15A连续电流表明器件可应对短暂过载场景(如电机启动瞬间)。

2. 导通损耗与效率

  • 导通电阻(RDS(on)):栅源电压(Vgs)为10V时,漏源导通电阻仅110mΩ。低导通电阻直接降低导通损耗(公式:损耗=I²×RDS(on)),提升电路效率,适合对效率要求较高的开关电源等场景。

3. 开关特性与驱动兼容性

  • 阈值电压(Vgs(th)):25℃、漏极电流(Id)=250μA时,阈值电压为3V,属于低阈值范围,可兼容5V、3.3V等常见控制电路,无需额外高驱动电压,降低驱动设计难度;
  • 栅极总电荷(Qg):Vgs=10V时为28nC,栅极电荷影响开关速度与驱动功率——28nC兼顾了中速开关需求(如DC-DC转换器)与低驱动功耗(无需大功率驱动芯片);
  • 输入/反向传输电容:输入电容(Ciss)1.122nF(Vds=50V时)、反向传输电容(Crss)28pF(Vds=50V时)。Crss较小可减少米勒效应影响,提升开关稳定性,降低EMI干扰。

4. 功率与温度适应性

  • 最大耗散功率(Pd):25℃时为50W,100℃时降额至约34W(与产品描述一致),满足不同温度下的功率需求;
  • 工作温度范围:-55℃至+175℃,覆盖工业级宽温要求,可适应户外、高温车间等极端环境,提升产品可靠性。

三、封装与物理特性

MCU15N10A-TP采用DPAK封装(又称TO-252),属于表面贴装式封装,具备以下特点:

  • 体积紧凑:引脚间距小,节省PCB布局空间,适合小型化产品设计;
  • 散热性能:封装底部(漏极引脚)可直接焊接到PCB铜箔,通过铜箔散热,满足15A电流下的散热需求;
  • 引脚定义:标准DPAK引脚为“中间=漏极(D)、两侧=源极(S)、一侧=栅极(G)”,方便工程师快速识别与焊接。

四、典型应用场景

结合参数特性,该器件典型应用包括:

  1. DC-DC转换器:如降压型(Buck)转换器,低RDS(on)减少导通损耗,宽温范围适应工业电源需求;
  2. 小型电机驱动:直流电机、步进电机驱动电路,15A电流覆盖小功率电机,无触点开关提升寿命;
  3. 负载开关:电池保护电路、电源切换模块,低阈值电压易驱动,宽温适应户外储能设备;
  4. 工业控制:继电器替代方案,无机械触点、抗振动,适合机床、自动化设备;
  5. 太阳能微逆变器:低压微逆开关器件,宽温范围适应户外环境(-40℃至+85℃)。

五、性能优势与适用价值

该器件核心价值体现在:

  • 效率优先:低导通电阻降低损耗,提升电路转换效率,减少散热需求;
  • 驱动简单:3V阈值兼容主流控制电路,无需复杂驱动设计;
  • 环境适应性强:宽温范围覆盖工业、户外等极端场景;
  • 性价比高:MCC品牌保障可靠性,DPAK封装降低成本,适合批量应用;
  • 开关稳定:低Crss减少米勒效应,提升开关稳定性,降低EMI干扰。

综上,MCU15N10A-TP是针对中低功率开关场景优化的N沟道MOSFET,平衡了效率、驱动难度与环境适应性,适合工业控制、消费电子等领域的多种应用需求。

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