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MCC LMB110S-TP LMB110S
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC LMB110S-TP
- Type
- MCC
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- LMB110S-TP
- Electronic Component
- 1
- Package
- LMBS-1
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.169g
- Electronic Component
- 1
- Electronic Component
- BM0259277888
- Current
- 1A
- Current(Ir)
- 100uA@100V
- (Vf)
- 850mV@500mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LMB110S-TP 产品概述
一、产品简介
LMB110S-TP 是美微科（MCC）推出的一款单相整流器件，封装为 LMBS-1。器件设计用于低至中等功率的整流和保护场合，具有较低正向压降与良好的反向耐压性能，适合开关电源、适配器、通用整流以及极性保护等应用。
二、主要特性
- 正向压降：Vf = 0.85 V（在 If = 500 mA 时测得），在中等电流工作下能保持较低功耗。
- 额定整流电流：1 A（平均整流电流，适合常规 PCB 封装的散热条件）。
- 直流反向耐压：Vr = 100 V，可用于较高直流母线电压的保护与整流。
- 反向漏电流：Ir = 100 µA（在 100 V 时），保证在高压条件下的低漏电损耗。
- 非重复峰值浪涌电流：Ifsm = 30 A（单次脉冲浪涌能力），可承受开机或瞬态冲击。
- 工作结温范围：-55 ℃ ～ +150 ℃，适应广泛温度环境。
三、电气与热特性要点
- 在典型使用条件（If ≤ 500 mA）下器件正向压降约为 0.85 V，散热主要通过 PCB 铜箔进行，建议在设计时留出足够的散热铜面并考虑适当的电流降额。
- 反向漏流在高压下虽有限，但长期高温高压工况会使漏流上升，建议对高温环境进行验证。
- 浪涌能力为 30 A 单次峰值，适用于短时输入冲击，但不宜用作频繁的高能量浪涌承受元件。
四、典型应用
- 开关电源输出整流与二极管整流网络。
- 充电器与适配器的整流/保护电路。
- 极性保护、反向保护与稳压前级整流。
- 工业控制与消费电子中对 100 V 级别直流的整流场合。
五、使用建议与注意事项
- 建议在 1 A 附近工作时做好 PCB 散热设计（增大铜箔面积或加散热过孔），避免长期在额定值附近运行以延长寿命。
- 对于高温（靠近 150 ℃）或长期高漏电流敏感的电路，应考虑降额使用或选用更低漏电的器件。
- 在焊接与回流时遵循封装耐温限制与厂家推荐的焊接曲线，避免温度骤变导致封装损伤。
- 存储与搬运注意防潮、防静电。
六、包装与采购信息
- 品牌：MCC（美微科）；封装：LMBS-1；型号：LMB110S-TP。
- 在选型时请参考厂家数据手册的典型曲线与最大限值表，并根据实际应用场景进行必要的可靠性与热仿真验证。若需替代型号或更高电流/更低 Vf 的器件，可联系供货商了解系列产品。
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