WMSIC Electronic Components

MCC SI2333-TP SI2333

ModelSI2333-TP
PackageSOT-23-3
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 137588

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
MCC SI2333-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
SI2333-TP
Electronic Component
1
Package
SOT-23-3
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.046g
Electronic Component
1
Electronic Component
BM69418183
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.1W
Gate Voltage(Vgs)
±8V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2333-TP 产品概述

产品简介

SI2333-TP 是一款高性能的 P 型 MOSFET(场效应晶体管),专为高效能、紧凑型电子设计而开发,封装采用广泛使用的 SOT-23-3 表面贴装型。该产品特别适用于要求较高电流处理能力以及较小占用空间的应用环境,例如便携式设备、电源管理系统以及模拟信号开关等。

关键参数

  • 安装类型: 表面贴装型(SMD),便于自动化组装和空间节省。
  • 漏极电流(Id): 6A(在 Tc = 25°C 时),支持较高的负载能力,适合多种应用。
  • 导通电阻(Rds On): 在 500mA、1.5V 时最大值为 150 毫欧,保证低功耗损耗,提升转化效率。
  • 漏源电压(Vdss): 12V,适合低电压应用领域,确保元件的安全工作范围。
  • 工作温度范围: -55°C ~ 150°C(TJ),使其在极端环境下也能正常运行。
  • 最大栅源电压(Vgs): ±8V,保护电路稳定且增加可靠性。

性能特点

SI2333-TP 在多个关键参数上表现出色,成为设计工程师在选择元器件时的优先考虑对象。其最大导通电阻和低栅极电荷(Qg,最大值为 2nC @ 4.5V)确保了其在频率较高的应用中的快速响应能力,提升了开关频率和效率。这种元件适用于快速开关电源(SMPS)、DC-DC 转换器以及各种开关电路。

电子特性

  • Vgs(th): 在 250µA 时最大为 1V,意味着在较低的驱动电压下,MOSFET 就可以开启,适合电源和信号电路的控制。
  • 输入电容(Ciss): 最大值为 1275pF @ 6V,适合高频应用,确保信号的传导效率。
  • 功率耗散(Pd): 最大功率耗散能力为 350mW(在 Tc 下),有效控制热量,提升系统的稳定性和可靠性。

应用场景

SI2333-TP 可广泛应用于各种电子和电力管理系统中,包括:

  • 电池供电设备: 在便携式设备、电动工具和移动电话中,通过高效控制电流,延长电池使用寿命。
  • 电源管理: 可用于开关电源转换器、DC-DC 转换器,以提高能效和降低功耗。
  • 信号开关: 在模拟开关应用中,SI2333-TP 可以精确控制信号流,应用于音频和视频设备。
  • 负载开关: 在大型电器和家用设备中控制负载,保持系统的靓丽高效。

结论

总之,SI2333-TP 是一款设计优化且功能强大的 P 通道 MOSFET,具有满足当今电子设备需求的关键性能和灵活性。无论是在便携式应用、开关电源,还是在更复杂的电力管理系统中,SI2333-TP 都能够为工程师提供高度可靠的解决方案。凭借其优异的性能规格及宽范围的应用领域,SI2333-TP 是现代电子工程师实时设计的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.