WMSIC Electronic Components

MDD SK86C

ModelSK86C
PackageSMC(DO-214AB)
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD SK86C
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
SK86C
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Schottky Diode
Electronic Component
0.335g
Electronic Component
1
Electronic Component
BM0226999149
Current
8A
Diode
Electronic Component
Current(Ir)
1mA@60V
(Vf)
700mV@8A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SK86C 产品概述

一、产品简介

SK86C 是 MDD 提供的肖特基整流二极管,独立式(单只)封装,采用 SMC (DO-214AB) 封装形式。该器件针对中大电流整流及快速恢复场合设计,兼顾低正向压降与良好的高峰值浪涌能力,适合开关电源、DC-DC 转换器及电源保护等应用。

二、主要参数

  • 二极管配置:独立式
  • 正向压降 (Vf):典型约 640 mV,规格上限约 700 mV @ 8 A(视工作温度与测试条件而定)
  • 整流电流:8 A(直流)
  • 直流反向耐压 (Vr):60 V
  • 反向电流 (Ir):1 mA @ 60 V
  • 非重复峰值浪涌电流 (Ifsm):150 A
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SMC (DO-214AB)
  • 品牌:MDD

三、性能优势

  • 低正向压降:减小导通损耗,提高转换效率,尤其在高电流工作点可显著降低功耗和发热。
  • 大电流承载:8 A 连续整流能力配合 150 A 峰值浪涌能力,可应对瞬态冲击与启动浪涌。
  • 宽温度范围:-55 ℃ 至 +150 ℃ 的结温允许在苛刻环境下长期工作。
  • SMC 封装便于自动贴片与热管理,适合大批量制造。

四、典型应用

  • 开关电源(整流、续流)
  • DC-DC 降压/升压模块输出整流
  • 逆变器与电机驱动的保护电路
  • 汽车电子、通信设备、服务器电源的整流与防反接保护

五、封装与使用注意事项

  • 封装为 SMC (DO-214AB),安装时应保证良好散热通路,尽量靠近热沉或设大铜箔散热区以降低结温。
  • 在高电流或高温环境下需进行电流热降额设计,参考厂商曲线或实际热测试结果。
  • 焊接工艺应遵循封装回流焊规范,避免过热或反复高温循环。
  • 对于对反向漏电流敏感的应用,应验证 Ir 在工作温度下的实际值并预留裕量。

六、选型建议

在需兼顾效率与成本的中大功率整流场合,SK86C 是可靠选择。若系统要求更低的反向漏电、更高反向耐压或更低 Vf,可对比同家族或其它厂商更高规格的肖特基器件;如需并联以提升电流能力,注意均流与热平衡设计。购买时请确认供货批次与完整数据手册以获取详细特性曲线和封装尺寸信息。

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