WMSIC Electronic Components

MDD DSF1D

ModelDSF1D
PackageSOD-123FL
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD DSF1D
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
DSF1D
Electronic Component
1
Package
SOD-123FL
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0229465237
Current
1A
Diode
1
Current(Ir)
100uA
(Vf)
1.25V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DSF1D 超快恢复二极管产品概述

一、产品简介

DSF1D(别名 E1D)为 MDD 推出的超快恢复整流二极管,采用 SOD-123FL 低剖面封装,面向开关电源、开关管自由轮回、功率整流与保护等高速开关场合设计。该器件在 1A 工作电流下具有较低正向压降与快速的反向恢复特性,适合要求较高电压耐受能力又需快速切换的应用。

二、主要参数

  • 二极管类型:独立式整流二极管
  • 正向压降 Vf:1.25 V @ 1.0 A
  • 直流反向耐压 Vr:200 V
  • 平均整流电流(IO):1 A
  • 反向漏电流 Ir:100 µA(典型/最大值视温度而增)
  • 反向恢复时间 Trr:35 ns(超快恢复)
  • 非重复峰值浪涌电流 Ifsm:30 A(脉冲)
  • 工作结温范围 Tj:-55 ℃ ~ +150 ℃
  • 封装:SOD-123FL

三、特性与优势

  • 高电压耐受:200 V 反向电压适用于中高压开关电源与变换器。
  • 超快恢复:35 ns 的反向恢复时间显著降低开关损耗与交越损耗,提升效率并减小电磁干扰(EMI)带宽。
  • 良好峰值浪涌能力:30 A 的非重复峰值浪涌允许在启动、短路或大电流充电情形下短时间承受冲击。
  • 小型低剖面封装:SOD-123FL 便于表贴加工、密集 PCB 布局及良好焊接可靠性。
  • 宽温区工作能力:-55~150 ℃ 的结温范围利于高温工作环境下的稳定性。

四、典型应用场景

  • 开关电源(SMPS)次级整流与初级续流器件
  • 贴片式功率转换模块(如升压、反激、半桥、全桥)
  • 自由轮回二极管与电感放电回路
  • 极性保护、反向电流阻断与浪涌抑制电路
  • 工业与民用电子中需要高压+快速恢复的整流场合

五、封装与热管理建议

SOD-123FL 提供较低热阻与小占板面积,但在连续 1 A 以上工作时仍需注意散热与 PCB 散热铜皮面积。建议:

  • 在管脚附近增加散热铜箔并与底层铺铜连通;
  • 使用合理的锡膏、焊盘设计以降低接触热阻;
  • 对于高平均功率场合,进行热仿真并采用合适的元件间距与通风。

六、使用注意事项

  • 反向漏流会随温度增加而上升,设计时考虑最大工作温度下的漏电影响;
  • 在高 dv/dt 环境中仍可能产生尖峰电压,应配合 RC 缓冲或箝位电路以保护器件;
  • 浪涌电流 Ifsm 为非重复脉冲能力,长期重复冲击会损害器件;
  • 焊接应遵循厂商推荐的回流曲线并注意防潮保存。

七、选型建议

如需在高压(≥200 V)且要求快速恢复的整流位置,DSF1D 为经济有效的选择。若对正向压降有更严格要求且电压较低,可考虑 Schottky 型器件;若对反向恢复更快或更低反冲能要求更高,则评估更短 Trr 或零恢复的器件。最终选型请以实际工作电流、浪涌特性、温度范围及 PCB 散热能力为准,并参考完整数据手册进行热应力与寿命验证。

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