Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD BZT52C16
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD BZT52C16
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- BZT52C16
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.035g
- Electronic Component
- 1
- (Zzt)
- 40Ω
- Electronic Component
- BM0258755330
- Diode
- 1
- Current(Ir)
- 100nA@12V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 15.2V~16.8V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C16 产品概述
一、产品简介
BZT52C16 是一款独立式小功率稳压（齐纳）二极管，标称稳压值为 16V，适用于表面贴装（SOD-123 封装）的低功耗电压基准与简单稳压场合。本产品由 MDD 品牌提供，结构紧凑、成本低、可靠性好，适合消费电子、仪表和控制类电路中作为基准稳压或浪涌限幅元件使用。
二、主要电气参数
- 标称稳压：16V（Vz）
- 稳压值范围：15.2V ~ 16.8V（典型制造公差）；部分供应信息表明样片范围可见 15.3V ~ 17.1V，须以采购批次的技术说明为准
- 反向漏电流 Ir：100nA @ 12V（低漏电，适合高阻抗电路）
- 耗散功率 Pd：500mW（器件最大耗散，须注意热设计与降额使用）
- 动态阻抗 Zzt：40Ω（在规定测试条件下测得，表示稳压特性在小信号下的斜率）
- 二极管类型：独立式稳压二极管（SOD-123）
以上参数用于元件选型与电路仿真时需结合实际工作电流与环境温度进行考虑。
三、封装与热管理
SOD-123 为常见小型表面贴装封装，适合自动化贴装与回流焊工艺。由于 Pd 仅 500mW，实际应用中务必：
- 做好 PCB 热量扩散（尽量增加焊盘面积并与接地或电源铜箔热铜连通）；
- 在高环境温度或较大稳流条件下对二极管进行功率降额使用；
- 计算稳压工作电流 Iz = Pd / Vz（在满足耗散功率的前提下选择串联限流电阻或分流方案）。
例如在单端串联限流的简单并联稳压电路中，需保证 Vz × Iz ≤ Pd，并留有安全裕量。
四、典型应用
- 低功耗参考电压源：为微控制器外设、传感器提供稳定电压基准；
- 输入防护与浪涌限幅：在信号线或低电压电源线做过压保护；
- 简单稳压电路：与串联限流电阻配合，用于替代线性稳压器的低成本场合；
- 失效保护或漏电检测回路：利用其低漏电流特性在高阻抗回路中工作。
五、使用建议与注意事项
- 选型时确认所购批次的稳压范围与典型测量条件（厂家技术手册为准），不同批次或供应商标注可能存在微小差异；
- 设计电路时应考虑动态阻抗对负载变化的影响，若需更稳定参考应增加后级缓冲；
- 对焊接工艺友好，但避免超过推荐回流温度与时间，防止封装或性能退化；
- 储存与装配时注意静电防护与防潮措施，常规为 RoHS 合规材料，应参照具体出货物料声明。
总结：BZT52C16（SOD-123）以其 16V 稳压点、低漏电与小封装优势，适合用于空间受限且功率需求较低的场合。正确的热设计与合理的电流选择是确保长期稳定运行的关键。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
