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MDD ST10100
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD ST10100
- Type
- MDD
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- ST10100
- Electronic Component
- 1
- Package
- TO-277
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.16g
- Electronic Component
- 1
- Electronic Component
- BM0258755376
- Current
- 10A
- Diode
- Electronic Component
- Current(Ir)
- 25uA@100V
- (Vf)
- 600mV@10A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ST10100 产品概述
一、产品简介
ST10100 为 MDD 出品的独立式肖特基整流二极管，封装为 TO-277，额定整流电流 10A、反向耐压 100V。器件针对需要低正向压降与高速整流的中小功率电源与保护电路设计，适合整流、续流与反并联保护等应用场景。
二、主要电气参数
- 正向压降（Vf）：标称 0.6V @ 10A（典型 0.7V @ 10A）
- 直流反向耐压（Vr）：100V
- 额定整流电流：10A（直流）
- 反向漏电流（Ir）：25μA @ 100V
- 非重复峰值浪涌电流（Ifsm）：240A
- 工作结温范围：-55℃ ～ +150℃
三、性能特点
- 低正向压降：相比普通硅整流器，Vf 较低，可降低导通损耗，提升整机效率。
- 快速恢复与低开关损耗：肖特基结构使器件开关响应迅速，适合高频整流与开关电源。
- 较高浪涌承受能力：240A 的峰值浪涌电流使其在瞬态冲击场景下更可靠。
- 宽工作温度：-55℃ 至 +150℃，适应较恶劣环境。
四、典型应用
- 开关电源整流桥或次级整流
- DC-DC 转换器续流二极管
- 电池充放电保护、逆向防护
- 功率模块、充电桩小功率回路、汽车电子（在符合热管理与耐压要求下）
五、选型与使用建议
- 散热设计：10A 连续工作时需重视封装热阻与散热片/底板，尽量使用合理导热路径并考虑空气对流或强制冷却。
- 漏电流依赖温度：在高温下反向漏电流会上升，设计应预留足够余量以避免热失控。
- 浪涌与保护：若系统存在频繁大浪涌或冒充电情况，应配合限流、电流保护器件或选择更大 Ifsm 余量的器件。
- 焊接与机械：遵循 TO-277 封装的焊接工艺规范，避免过热和应力集中，保证长期可靠性。
六、可靠性与注意事项
- 由于肖特基结构本身在高反向电压下漏电流相对较大，100V 工作点应评估温升与漏电容对电路性能的影响。
- 长期在高结温附近工作会加速失效，应在设计中适当降额使用（例如温度、持续电流）。
- 建议在样机验证阶段做热成像与整机寿命测试，确认在目标工况下的温度与电流裕量。
ST10100 以其低压降、高浪涌能力和宽温度范围，适合要求效率与瞬态耐受兼顾的电源与保护应用。选型时请结合系统散热、工作温度和浪涌特性进行综合评估。
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