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MDD SS54F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD SS54F
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- SS54F
- Electronic Component
- 1
- Package
- SMAF
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.056g
- Electronic Component
- 1
- Electronic Component
- BM0229465213
- Current
- 5A
- Diode
- 1
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@5A
- Electronic Component
- 50℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS54F 产品概述
一、产品简介
SS54F 为 MDD 出品的一款肖特基整流二极管，额定整流电流 5A、直流反向耐压 40V，典型正向压降为 550mV（测量条件 5A）。器件采用 SMAF 封装，适合对正向压降和开关速度有较高要求的中大电流整流场合，工作结温范围为 -50℃ 至 +125℃，具有良好的热稳定性与可靠性。
二、主要电气参数
- 正向压降 (Vf)：550mV @ IF=5A（典型值）
- 直流反向耐压 (Vr)：40V
- 最大整流电流：5A
- 反向漏电流 (Ir)：500μA @ VR=40V（环境温度未特别标注，按典型室温条件参考）
- 工作结温范围：-50℃ ~ +125℃
三、器件特点
- 低正向压降：在大电流下仍保持较低功耗，利于提高整机效率并降低发热。
- 快速恢复特性：肖特基结构天然无载流子反向恢复，适合高频开关电路。
- 宽温度工作范围：可用于工业级应用环境。
- 紧凑封装：SMAF 便于 PCB 布局和热管理，适合空间受限的设计。
四、典型应用
- 开关电源输出/续流整流（SMPS）
- DC-DC 转换器、降压模块（Buck）输出整流
- 汽车电子（低压回路、车载电源模块）
- 电池充放电保护与电源反向保护
- 功率管理模块、整机板级整流
五、封装与热管理建议
SMAF 封装需注意 PCB 散热设计：
- 在二极管热引脚处增加热铜箔面积与过孔以利散热；
- 在靠近高电流路径处使用较粗的走线以减少额外压降；
- 若长时间在接近最大额定电流工作，应评估结温，必要时加装散热片或风冷。
六、选型与使用注意事项
- 反向漏电流随温度升高而上升，若在高温环境或要求极低漏电流的系统中使用，应进行实际测试验证；
- 正向压降为典型值，设计时建议留有裕量并参考器件曲线或样片测试获得准确功耗估算；
- 如用于汽车或高可靠度场合，建议查验供应链的可靠性及相关认证资料。
总结：SS54F（MDD，SMAF 封装）为一款面向中大电流、低压降、高频整流场合的肖特基二极管，性能均衡，适用于开关电源、DC-DC 模块及一般功率整流应用。选择时请结合实际工作电流、结温与系统散热条件进行评估。
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