WMSIC Electronic Components

MDD SMAJ30CA

ModelSMAJ30CA
PackageSMA
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD SMAJ30CA
Type
MDD
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
SMAJ30CA
Electronic Component
1
Package
SMA
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.094g
Electronic Component
1
Electronic Component
BM0209705635
Operating Temperature
65℃~+150℃
Voltage
48.4V
Current(Ir)
1uA
Voltage(VBR)
36.8V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMAJ30CA(MDD)产品概述

一、产品简介

SMAJ30CA 是 MDD 出品的一款双向瞬态电压抑制器(TVS)二极管,封装为 SMA(DO‑214AC)。器件针对雷击、浪涌和开关瞬态等大幅度过电压事件提供快速钳位保护,适用于直流/交流供电线、通信接口及车载、工业级系统的过压防护。器件属于高能量吸收型 TVS,能在短时冲击下提供可靠保护而不致损坏。

二、主要技术参数

  • 类型:双向 TVS 二极管
  • 反向工作电压 Vrwm:30 V(额定持续工作电压)
  • 击穿电压(Vz):36.8 V(在指定测试条件下)
  • 钳位电压(典型):48.4 V(Ipp 条件下)
  • 峰值脉冲功率 Ppp:400 W @ 10/1000 μs(能量吸收能力指标)
  • 峰值脉冲电流 Ipp:8.3 A @ 10/1000 μs
  • 反向漏电流 Ir:1 μA(在 Vrwm 条件下的典型值)
  • 极限工作温度:‑65 ℃ ~ +150 ℃
  • 极性:双向(对称钳位,适合交流或双向瞬态)
  • 封装:SMA(DO‑214AC)

三、性能特点

  • 高能量吸收:在 10/1000 μs 浪涌波形下可承受 400 W 峰值功率,适合对抗雷击型冲击与长时间脉冲能量。
  • 双向保护:对正负瞬态均能有效钳位,适用于双电源线或交流/差分线缆保护。
  • 低漏电流:1 μA 的低反向电流有助于在待机或低功耗系统中保持低功耗特性。
  • 宽温度范围:‑65 ℃ 至 +150 ℃ 的工作温度覆盖工业及严苛环境需求。
  • SMA 小型封装:利于表面贴装自动化组装,节省 PCB 面积。

四、典型应用场景

  • 工业控制、电源输入端的浪涌保护
  • 通信设备、基站、电信线路保护
  • 汽车电子(非关键安全电路的抑制)、车载供电线路保护(需结合车规认证核验)
  • 消费电子和便携设备的输入/接口防护
  • 电力、太阳能逆变器等系统的局部过压保护

五、设计与布局建议

  • 放置位置:应尽量靠近被保护的接口或输入端,缩短从源到器件的走线,以减小串联感抗和更快速钳位。
  • 散热考虑:虽然为脉冲器件,但在频繁冲击或高能量情况下需考虑 PCB 铜箔及过孔散热,必要时使用热扩散层。
  • 串联器件:避免与高值串联电阻直接串联以免影响钳位性能;若需限流请认真评估冲击功耗分布。
  • 焊接工艺:SMA 为常见 SMT 封装,推荐遵循制造商的焊接曲线和回流规范以防封装应力或热损伤。
  • ESD/浪涌协同:TVS 可与小电流快速熔断器、PTC 或共模电感等器件配合使用, 提高整体保护可靠性。

六、选型与采购建议

在选型时,确认系统最大工作电压需低于 Vrwm(30 V),并考虑最大容许钳位(48.4 V)对下游器件的影响。Ppp 与 Ipp 指标用于评估对雷击或浪涌事件的抗扰能力;若系统可能遭受更高能量冲击,应选择更大能级或并联/级联保护策略。关于认证、批次及可追溯信息,请向 MDD 授权分销商或官方网站查询,并索取完整数据手册与应用说明以完成最终验证与可靠性评估。

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