Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD SMF5.0A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD SMF5.0A
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- SMF5.0A
- Electronic Component
- 1
- Package
- SOD123FL
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Electronic Component
- BM0227798530
- Operating Temperature
- 55℃~+150℃
- Voltage
- 9.2V
- Current(Ir)
- 400uA
- Voltage(VBR)
- 7V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMF5.0A 产品概述
一、产品简介
SMF5.0A（MDD 品牌）是一款单向瞬态电压抑制二极管（TVS），专为5V等级电源与信号线的浪涌及静电冲击保护而设计。器件采用小型 SOD123FL 封装，响应迅速、能量吸收能力强，适用于工业、通信、消费电子及要求宽温度工作的场合。
二、主要参数与特性
- 类型：单向 TVS 二极管（SMF5.0A）
- 反向截止电压（Vrwm）：5 V（适配 5V 供电保护）
- 击穿电压（Vbr）：7 V（典型）
- 钳位电压（Vc）：9.2 V @ Ipp（标称钳位电压）
- 峰值脉冲功率（Ppp）：200 W，波形 10/1000 µs
- 峰值脉冲电流（Ipp）：21.7 A @ 10/1000 µs
- 反向漏电流（Ir）：400 µA（在 Vrwm 条件下）
- 极性：单向（适合 DC/电源线保护）
- 工作温度：-55 ℃ 至 +150 ℃
- 封装：SOD123FL，适合 SMT 回流焊装配
三、典型应用场景
- 5V 电源总线保护（如 USB VBUS、板级 5V 供电）
- MCU、传感器及外围电路的浪涌和雷击抑制
- 工业控制与通信设备的电源防护
- 需要宽温度范围的嵌入式/车规环境（注意是否需额外认证）
四、封装与可靠性
SOD123FL 封装体积小、厚度低，便于空间受限的 PCB 布局。器件可承受工业级温度循环（-55 ℃ 至 +150 ℃），适配标准 SMT 回流焊工艺。在高能量冲击下，200 W（10/1000 µs）能量吸收能力和 21.7 A 的峰值电流保证了对瞬态事件的有效抑制。
五、选型与使用建议
- 若保护对象为直流电源或单向电压，应选择单向型（如 SMF5.0A）；若为双向交流或差分数据线，考虑双向 TVS。
- 钳位电压 9.2 V 应低于被保护器件允许的最大耐压，确保在冲击时受保护器件不被破坏。
- 关注漏电流 400 µA 对低功耗系统的影响，必要时评估休眠态能耗。
- 布局建议：将 TVS 尽量靠近受保护端口放置，走线最短以减少感性串扰并利于热量散逸；对高能量应用考虑在 TVS 前增加熔断/限流元件。
六、注意事项
- 本产品标称参数在实验条件下测得，实际应用时应参考数据手册完整曲线（V-I 特性、温度漂移等）。
- 若用于车规或关键安全系统，确认是否需要通过相应认证（例如 AEC-Q101）并核实器件版本。
总结：MDD SMF5.0A 以其针对 5V 系统的参数组合（Vrwm 5V、Vbr 7V、Vc 9.2V、200W 能量吸收）和紧凑的 SOD123FL 封装，成为板级和端口级浪涌保护的常用选择。在选型与 PCB 布局上注意漏电、钳位与热管理即可达到良好防护效果。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
