WMSIC Electronic Components

MDD HER208

ModelHER208
PackageDO-15
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD HER208
Type
MDD
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
HER208
Electronic Component
1
Package
DO-15
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.367g
Electronic Component
1
Electronic Component
BM0226436792
Current
2A
Current(Ir)
5uA@1kV
(Vf)
1.7V@2A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2500
Voltage Rating(Vr)
1kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MDD HER208 高效率整流二极管产品概述

一、产品简介

MDD HER208 为高效率整流二极管,采用 DO-15 轴向引线封装,额定直流正向电流 2A,直流反向耐压 1000V。器件针对开关电源与整流应用进行了优化,具有较低的正向压降与较小的反向恢复时间,适合中高频整流与保护回路使用。

二、关键电气参数

  • 正向压降 (Vf):1.7V @ 2A
  • 直流反向耐压 (Vr):1000V
  • 正向整流电流:2A(连续)
  • 反向电流 (Ir):5µA @ 1000V
  • 反向恢复时间 (Trr):70ns
  • 非重复峰值浪涌电流 (Ifsm):60A(单次浪涌)
  • 工作结温范围 (Tj):-65℃ ~ +150℃

三、主要特性与优势

  • 低正向压降:在额定电流下 Vf=1.7V,有助于降低整流损耗与发热,提升效率。
  • 高耐压能力:1000V 反向耐压适用于高电压整流与隔离电源应用。
  • 快速恢复:70ns 的反向恢复时间减少开关损耗与电磁干扰(EMI),适合开关电源和逆变器场合。
  • 低反向泄漏:5µA @1kV 的低漏电流有利于高压小电流回路的稳定性。
  • 高浪涌承受力:60A 的非重复峰值浪涌电流可应对启动或短时过载情形。

四、典型应用

  • 开关电源(SMPS)整流与自由轮回路
  • 工业电源与高压整流模块
  • 逆变器和电机驱动的续流二极管
  • 高压保护与阻断电路

五、安装与可靠性建议

  • 封装为 DO-15 轴向形式,适合手工或波峰/回流焊接的引线安装。注意引线焊接温度与时间以避免热损伤。
  • 在长期工作时应考虑结温管理与散热路径,必要时增加散热片或改善气流。
  • 浪涌应用需遵循 Ifsm 限值,避免重复超过峰值浪涌导致器件失效。
  • 在高压环境测试中,建议按产品规格进行耐压、漏电与温升验证。

六、选型与替代

HER208 适合需要 1kV 耐压且有一定开关频率要求的场景。选型时如需更低 Vf 或更短 Trr,可考虑肖特基或专用快恢复器件;如需更高电流能力,应选择更大封装或并联方案并注意均流与热管理。

如需器件 Datasheet、推荐脚位图或实际电气测试曲线,我可为你提供进一步资料与选型建议。

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