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MDD S1B
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD S1B
- Type
- MDD
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- S1B
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.094g
- Electronic Component
- 1
- Electronic Component
- BM0226603488
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA@100V
- (Vf)
- 1.1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S1B 通用整流二极管（MDD）产品概述
一、产品简介
S1B 为 MDD 品牌的一款独立式通用整流二极管，采用 SMA（DO-214AC）表面贴装封装。器件设计用于中低功率整流与开关保护场合，具有较低的正向压降与良好的耐压、耐温能力，适配工业与消费类电子中常见的电源及保护电路。
二、关键参数与性能特点
- 工作结温范围：-55℃ ~ +150℃，可满足宽温环境下长期可靠工作。
- 正向压降（Vf）：1.1V @ 1A，较低的导通电压可降低导通损耗与发热。
- 直流反向耐压（Vr）：100V，适合常见的12V/24V/48V系统整流与隔离。
- 反向电流（Ir）：5μA @ 100V，低漏电流有利于提高待机效率与减小误触发。
- 整流电流：1A（平均），满足中小功率整流需求。
综合上述参数，S1B 在体积受限且需兼顾效率与耐压的场合具有良好性价比。
三、典型应用场景
- 开关电源（小功率整流桥、续流）
- 适配器与充电器的输出整流与极性保护
- LED 驱动与背光电源整流
- 汽车电子（非关键高功率回路）、家电与工业控制电路的保护与整流
- PCB 上的反向保护、吸收钳位与自由轮回路
四、封装与热管理
SMA（DO-214AC）封装便于手工或回流焊装配，适合自动化贴片生产。由于为独立式二极管，实际散热依赖于 PCB 走铜面积与焊盘设计，应在热敏应用中增加散热铜箔或热通孔以降低结温升高，确保长期可靠性。
五、使用建议与注意事项
- 选型时根据最大工作电压、峰值脉冲电流与环境温度余量留有裕度；避免长时间在额定极限工作。
- 焊接时按推荐回流曲线处理，避免过高温度与过长保温时间引起器件热应力。
- 对电流突变或高频开关应用，需评估瞬态功率与可能的浪涌电流，必要时并联或选用更高额定电流器件。
六、可靠性与采购信息
MDD S1B 提供稳定的电气性能与宽温工作能力，适合大批量生产与长期供应链需求。订购时请核对完整型号、封装与出厂文件（规格书、焊接建议与可靠性测试报告）以保证与应用的一致性。
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