WMSIC Electronic Components

MDD 1N5408

Model1N5408
PackageDO-201AD
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD 1N5408
Type
MDD
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
1N5408
Electronic Component
1
Package
DO-201AD
Electronic Component
General Purpose Diode
Electronic Component
1.105g
Electronic Component
1
Electronic Component
BM0229465231
Current
3A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.2V@3A
Electronic Component
65℃~+175℃
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N5408 产品概述

1N5408 为通用整流二极管,适用于中低频整流与一般功率整流场合。MDD 品牌,DO-201AD 轴向封装,额定直流反向耐压 1kV、平均整流电流 3A,具备较高的浪涌承受能力和宽广的工作结温范围,可满足工业级电源与耐压较高的整流需求。

一、主要参数

  • 型号:1N5408(MDD)
  • 直流反向耐压(Vr):1000 V
  • 平均整流电流:3 A
  • 正向压降:约 1.2 V @ 3 A
  • 反向电流(Ir):5 µA @ 1 kV
  • 非重复峰值浪涌电流(Ifsm):150 A
  • 工作结温范围:-65 ℃ ~ +175 ℃
  • 封装:DO-201AD(轴向)

二、关键特性与性能解读

1N5408 为硅整流二极管,属于通用整流器件,正向压降典型约 1.2V(在 3A 时),在大多数整流应用中效率与热耗处于可控范围。高达 1kV 的反向耐压与极低的反向漏电(5µA@1kV)使其适用于高压直流链路。150A 的单次浪涌能力保证了对瞬态冲击电流的良好承受力。

三、封装与热管理

DO-201AD 轴向封装具有良好的机械强度和热容量,便于波峰焊或手工焊接。在高电流工作状态下应注意散热,推荐在 PCB 布局中采用足够的铜箔面积或外加散热片,以降低结温并延长可靠性。高温下反向漏电会显著上升,应在高温环境中进行电流/功率降额设计。

四、典型应用场景

  • 开关电源与线性电源整流桥
  • 高压整流与直流链路保护
  • 电池充放电与充电机控制
  • 逆变器、马达驱动和工业电源设备
  • 一般功率电子和电源模块替换元件

五、选型与使用注意事项

  • 若应用存在频繁高频开关,应考虑快恢复或肖特基二极管替代;1N5408 为慢恢复整流器,适合工频或开关频率较低场合。
  • 按功耗与结温计算所需散热能力,确保在最大工作电流下结温不超过限值。
  • 浪涌能力虽高,但对于反复冲击或长期脉冲应采取额外保护(熔断器、限流器或浪涌抑制器)。
  • 注意极性标识,轴向封装一端通常有阴极标记(环形或带状)。

六、采购与存储建议

选择正规渠道采购以保证原厂或授权替代件;接收后建议在干燥、常温环境中保存,避免潮湿与机械冲击。长期库存前可参考厂家储存规范并做好入库记录,便于质量追溯。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.