Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD ES3JB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD ES3JB
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- ES3JB
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.335g
- Electronic Component
- 1
- Electronic Component
- BM0226178457
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 5uA@600V
- (Vf)
- 1.68V@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES3JB 快恢复/高效率二极管产品概述
概要
ES3JB 是由 MDD 品牌生产的快恢复/高效率二极管，采用独立式配置，适用于各种高频和高效率应用场景。以下是对该产品的详细介绍。
基础参数
- 二极管配置: 独立式
- 反向恢复时间 (trr): 35 ns
- 反向电流 (Ir): 5 μA @ 600 V
- 商品分类: 快恢复/高效率二极管
- 工作温度: -55℃ ~ +150℃ @(Tj)
- 整流电流: 3 A
- 正向压降 (Vf): 1.68 V @ 3 A
- 直流反向耐压 (Vr): 600 V
描述
ES3JB 快恢复/高效率二极管是专为高频和高效率应用而设计的。其主要特点包括：
- 低反向恢复时间: 仅 35 ns 的反向恢复时间，使其在高频切换应用中表现出色，减少了因恢复时间长而引起的能量损失。
- 高整流电流: 支持最大 3 A 的整流电流，适用于中到高功率的电子设备。
- 低正向压降: 在 3 A 的工作条件下，正向压降仅为 1.68 V，这意味着在相同的工作条件下，能量损失较小，从而提高了系统的整体效率。
- 高直流反向耐压: 可以承受高达 600 V 的直流反向耐压，确保在高压环境下稳定运行。
封装
ES3JB 采用 DO-214AA（SMB）封装，这是一种小型化的封装形式，适合于空间有限但要求高性能的应用场景。SMB 封装具有良好的热性能和机械强度，能够满足各种严苛的环境条件。
工作温度范围
该二极管的工作温度范围从 -55℃ 到 +150℃，这使得它可以在极端温度条件下稳定运行，适用于汽车电子、工业控制、医疗设备等多种领域。
应用场景
ES3JB 快恢复/高效率二极管广泛应用于以下领域：
- 电源管理: 在开关模式电源（SMPS）中，ES3JB 可以作为反馈二极管或自由轮流二极管，提高系统效率和稳定性。
- 汽车电子: 由于其宽泛的工作温度范围和高耐压能力，ES3JB 适用于各种汽车电子系统，如点火系统、电动助力转向系统等。
- 工业控制: 在工业控制系统中，ES3JB 可用于驱动器、变频器和其他需要高频、高效率的应用。
- 医疗设备: 由于其高可靠性和稳定性，ES3JB 也被用于医疗设备中的电源模块和信号处理单元。
总结
MDD 的 ES3JB 快恢复/高效率二极管通过其卓越的性能参数和广泛的适用性，成为各类电子设备中不可或缺的组件。其低反向恢复时间、低正向压降和高直流反向耐压，使其在高频和高效率应用中表现出色。同时，其宽泛的工作温度范围和小型化封装形式进一步扩展了其应用领域。对于需要高性能、可靠性和效率的电子系统设计，ES3JB 是一个理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
