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MDD SS310C
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD SS310C
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- SS310C
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.335g
- Electronic Component
- 1
- Electronic Component
- BM0226436799
- Current
- 3A
- Diode
- Electronic Component
- Current(Ir)
- 300uA@100V
- (Vf)
- 850mV@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MDD SS310C 肖特基二极管产品概述
一、产品简介
MDD SS310C 为独立式肖特基整流二极管，采用SMC (DO-214AB) 封装，面向中功率整流与开关电源应用。器件额定整流电流为3A，直流反向耐压为100V，典型正向压降为850mV（IF=3A），在100V 反向电压下的反向电流为300µA。工作结温范围宽 (-55℃ ~ +150℃)，适合要求耐温与可靠性的电源场合。
二、主要电气参数
- 整流电流（IF）：3A（连续）
- 直流反向耐压（VR）：100V
- 正向压降（Vf）：850mV @ IF=3A
- 反向电流（IR）：300µA @ VR=100V
- 工作结温（Tj）：-55℃ ~ +150℃
- 二极管配置：独立式
三、特性与优势
- 低正向压降：Vf≈0.85V 在3A工作时相比普通整流管损耗更低，有利于提高整流效率并降低发热。
- 快速整流响应：肖特基结构固有的无恢复时间特性，适合高频开关电源与快恢复整流需求。
- 宽温度范围：-55℃至+150℃的结温允许在苛刻环境下长期工作。
- SMC 封装：便于手工焊接与自动贴片，适配标准电源板布局，具备一定热容量。
四、典型应用
- 开关电源输出整流（SMPS）
- DC-DC 转换器与降压模块
- 反向电池保护与极性保护电路
- 电池充电器与电源管理
- 电机驱动与自由轮回流路径
五、封装与热管理建议
SMC (DO-214AB) 封装具有较好的焊盘面积和热传导路径，但3A 连续工作时仍需注意热管理：
- 在PCB上为器件引脚和背面留足铜箔，必要时加铺大面积散热铜或多盏过孔以提高散热。
- 设计时按最高环境温度与功耗进行电流/温度降额计算，避免长期接近结温上限。
- 推荐遵循无铅回流工艺规范进行焊接（峰值温度与时间按业界标准）。
六、使用注意事项
- 反向漏电随温度上升显著增加，在高温或高反向电压工作时应验证IR对系统的影响。
- 避免超过最大额定电流和反向电压，关注瞬态电压和浪涌电流。
- 采用良好PCB布局：最短电流回路、足够铜厚、靠近开关元件放置可降低寄生阻抗与热阻。
- 储存与装配参考制造商和IPC/JEDEC标准，防潮、防静电。
七、对比与替代建议
SS310C 适合需要100V电压等级和约3A电流、追求较低Vf的场景。若系统更重视更低Vf或更低反向漏电，可考虑更高性能的低Vf肖特基或并联多颗器件以分担电流；若需要更高耐压，则选择更高Vr等级的肖特基或超快速恢复二极管。
总结：MDD SS310C 在中低功率电源整流与保护场合提供了良好的正向损耗-频率特性平衡，是通用电源设计中性价比高的选择。若需详细热阻、伏安曲线或封装尺寸，请参见厂家数据手册以完成最终设计验证。
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