WMSIC Electronic Components

MDD MDD3401

ModelMDD3401
PackageSOT-23
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD MDD3401
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
MDD3401
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0227798531
Operating Temperature
50℃~+150℃
Power Dissipation(Pd)
1.2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
655pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MDD3401 产品概述

一、主要特性

MDD3401 是一颗 P 沟道场效应晶体管(P‑MOSFET),单颗封装于 SOT‑23 外壳,适合做高侧开关与电源反向保护。主要电气参数如下:漏源耐压 Vdss = 30 V,连续漏极电流 Id = 4.2 A,导通电阻 RDS(on) = 45 mΩ(在 Vgs = −10 V、Id ≈ 4.1 A 时测得);耗散功率 Pd = 1.2 W;栅极阈值 Vgs(th) ≈ 0.5 V。栅极总电荷 Qg = 8.5 nC(@15 V),输入电容 Ciss = 655 pF(@15 V),反向传输电容 Crss = 53 pF,输出电容 Coss = 65 pF。器件工作温度范围为 −50 ℃ 至 +150 ℃。品牌:MDD。

二、性能要点与意义

  • 低导通电阻(45 mΩ)使得在中等电流(数安培)条件下导通损耗较小,适合电源开关场景。
  • 相对适中的栅极电荷(8.5 nC)意味着在驱动速度与驱动功耗之间取得平衡,适合需要中等开关频率的电源管理电路。
  • 母线耐压 30 V 满足常见汽车电子、便携电源与工业控制中低电压侧的保护与切换要求。
  • SOT‑23 小封装有利于节省 PCB 面积,但散热能力有限,需注意版面热设计。

三、典型应用场景

  • 电池管理与电源路径选择(高侧负载开关、反向保护)
  • 便携设备电源切换与充电路径控制
  • 低功耗放电回路、负载断开与保护电路
  • 小功率 DC‑DC 转换器中的同步开关(低频)与辅助开关

四、封装与 PCB 布局建议

  • SOT‑23 封装散热受限,1.2 W 的耗散功率依赖于 PCB 铜箔与散热面积。建议在器件下方与引脚相连处使用拓宽的铜箔和过孔,增加热传导至多层板内层或底层地铜。
  • 栅极驱动走线应尽量短且靠近驱动源,串联小阻抗(如 10 Ω)可抑制振铃并保护驱动器。
  • 输入端(源)和输出端(漏)应配合适当旁路与去耦电容,以降低开关瞬变电压并稳定系统。

五、选型与使用注意事项

  • 注意器件的额定 Vgs 和最大允许栅源电压(请以原厂数据手册为准),驱动电压应在安全范围内。
  • 在高温或长期导通条件下需对 RDS(on) 随温度上升导致的损耗增长进行余量设计,避免过热。
  • 对开关频率敏感的应用需评估 Qg、Ciss 对驱动功耗与开关损耗的影响。
  • ESD 防护与正确封装焊接工艺可提高成品良率和可靠性。

六、总结

MDD3401 在 SOT‑23 小封装中提供了 30 V 耐压、约 4 A 等级和较低的导通电阻,适合体积受限且需高侧开关或电源保护的中低功率应用。合理的 PCB 热设计与合规的驱动电压策略,可以充分发挥其低损耗和易集成的优势。欲获取更详尽的极限参数与曲线(如 RDS(on) 随温度变化、Vgs 最大值等),请参阅 MDD 官方数据手册。

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