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MDD RS5MC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD RS5MC
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- RS5MC
- Electronic Component
- 1
- Package
- SMC/DO-214AB
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.379g
- Electronic Component
- 1
- Electronic Component
- BM0264463834
- Current
- 5A
- Diode
- 1
- Current(Ir)
- 5uA
- (Vf)
- 1.3V@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RS5MC 快恢复高效率二极管产品概述
一、产品核心定位
RS5MC是MDD品牌推出的独立式快恢复/高效率二极管，属于中功率高压快恢复器件范畴。其设计核心是在1kV高压耐受能力下，实现低导通损耗、快速反向恢复特性，同时以SMC贴片封装满足小型化、自动化生产需求，适配中高压、中等功率的整流/续流场景。
二、关键参数详解
2.1 电气性能参数
- 正向压降（Vf）：典型值1.3V@3A连续电流，5A负载时仍保持1.3V左右——相比普通整流管（如1N5408），导通损耗降低约20%，可有效减少电路发热。
- 直流反向耐压（Vr）：额定值1kV，具备充足过压余量，满足1000V以下AC/DC变换等中高压电路的安全需求。
- 整流电流（If）：连续直流电流额定5A，支持中等功率设备的稳定工作。
- 反向恢复时间（Trr）：500ns（快恢复二极管范畴，普通整流管Trr通常>10μs），显著降低开关损耗，提升高频电路效率。
- 工作结温范围：-55℃~+150℃，覆盖工业级宽温环境（户外设备、车载电子等），可靠性更优。
2.2 物理与封装参数
- 封装类型：SMC（DO-214AB）表面贴装封装，尺寸紧凑（典型3.5mm×2.5mm×1.8mm），适合PCB小型化设计，支持自动化贴装（SMT）。
- 极性标识：通过丝印区分阴极（靠近丝印端），便于安装识别。
三、可靠性与设计优势
- 宽温可靠性：-55℃~+150℃结温范围，可在极端环境（低温户外、高温车间）稳定工作，无需额外散热降额。
- 低损耗设计：低Vf（导通损耗）+快Trr（开关损耗）结合，尤其适合100kHz以上高频开关电源。
- 封装散热优化：SMC封装通过芯片与引脚热连接优化，配合PCB铜箔可有效散发热量，满足5A连续电流需求。
- 高压耐受余量：1kV额定耐压可应对瞬时过压（雷击、开关浪涌），减少器件损坏风险。
四、典型应用场景
RS5MC适配多种中高压中等功率场景：
- 开关电源：AC-DC高压电源整流级、DC-DC变换器续流二极管，转换效率可达90%以上。
- 逆变电路：太阳能逆变器、UPS的逆变桥续流，1kV耐压适配600V~800V母线。
- 电机驱动：BLDC无刷电机、伺服电机续流回路，低Vf减少驱动电路发热，快Trr提升响应速度。
- 工业电源：PLC、变频器辅助电源整流，宽温范围满足工业环境要求。
五、选型对比与注意事项
5.1 选型对比
器件型号 反向耐压（Vr） 整流电流（If） 反向恢复时间（Trr） 封装 核心优势 RS5MC 1kV 5A 500ns SMC 高压+快恢复+低Vf FR507 800V 5A 500ns SMC 成本略低，耐压稍弱 1N5408 1000V 3A >10μs DO-27 成本低，不适合高频5.2 注意事项
- 安装需确认极性（丝印端为阴极），避免反向接入损坏；
- 5A连续电流下，PCB铜箔散热面积建议≥10cm²；
- 环境温度超85℃时，需参考MDD datasheet降额使用。
以上概述覆盖RS5MC的核心特性、参数、应用与选型，可作为工程选型的实用参考。
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