Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD MDD3400
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD MDD3400
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- MDD3400
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0224385408
- Operating Temperature
- 50℃~+150℃
- Power Dissipation(Pd)
- 1.5W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MDD3400 产品概述
1. 引言
MDD3400是一款高效能的N沟道场效应管（MOSFET），采用SOT-23封装，专为低电压和高电流应用设计。其主要特性包括超低导通阻抗（27mΩ@10V）、耐压能力达到30V，以及最大持续电流高达5.8A。这些特性使得MDD3400在现代电子设备中具有极高的应用价值。
2. 主要特点
- 超低导通阻抗：27mΩ的导通阻抗在10V的栅压下，意味着在开启状态下，MDD3400能够提供极低的功率损耗。这对于要求高效率和低热量产生的电子电路，特别是在开关电源和电机驱动中尤为重要。
- 电流能力：最大电流可达5.8A，确保了该MOSFET适用于多种高功率应用，包括LED驱动、电源管理和音频放大器等。
- 耐压特性：30V的耐压水平使其适用于大多数中低压电子产品，为设计师提供了更大的灵活性。
3. 结构与封装
MDD3400采用SOT-23封装，这是一种小型、轻便且成为广泛使用的表面贴装封装形式。SOT-23封装的设计使得MDD3400在空间有限的应用中依然能够实现高效散热和电气性能。这种封装非常适合于移动设备和小型电子产品的集成，使他们能够更紧凑且更高效。
4. 应用场景
MDD3400可应用于多种电子电路和设备中，包括但不限于：
- 开关电源：在DC-DC转换器和AC-DC转换器中，MDD3400可以有效地控制电源的开关状态，提高整体能效，降低待机功耗。
- 电机控制：在电动机驱动器和伺服系统中，其高电流能力和低导通阻抗使得MDD3400可以快速响应电动机负载变化，从而实现精准控制。
- LED驱动：在LED照明和显示应用中，MDD3400可以作为开关元件，通过调节电流以控制LED的亮度和色彩。
- 移动设备：由于其小巧的封装形式，MDD3400适用于手机、平板和其他便携式电子设备，其中效率和空间利用率至关重要。
5. 性能参数
以下是MDD3400的一些关键性能参数：
| 参数 | 值 |
|---|---|
| 封装 | SOT-23 |
| 导通阻抗 (RDS(on)) | 27mΩ@10V |
| 耐压 (VDS) | 30V |
| 最大漏极电流 (ID) | 5.8A |
| 门源阈值电压 (VGS) | 2V - 4V |
| 工作温度范围 | -55°C to +150°C |
6. 结论
MDD3400由于其极低的导通阻抗、适中的耐压与电流能力，适用于广泛的电力管理与控制应用，是现代电子产品不可或缺的组件之一。无论是在高效的开关电源、精确的电机驱动，还是在紧凑的便携设备中，它都能提供卓越的性能和可靠性。考虑到日益增长的节能需求和小型化趋势，MDD3400无疑是各类设计工程师的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
