WMSIC Electronic Components

MDD BZT52C6V8

ModelBZT52C6V8
PackageSOD-123
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD BZT52C6V8
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
BZT52C6V8
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.035g
Electronic Component
1
(Zzt)
30Ω
Electronic Component
BM0226510994
Diode
1
Power Dissipation(Pd)
500mW
Electronic Component
6.46V~7.14V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C6V8 稳压二极管(MDD,SOD-123)产品概述

一、产品简介

BZT52C6V8 是一款独立式小功率恒压二极管,由 MDD 品牌提供,采用 SOD-123 表面贴装封装。该型号标称稳压值为 6.8V,适合在低功耗、面积受限的场合做基准稳压、稳压保护和电压钳位等用途。器件体积小、易于贴装,适配自动化生产线。

二、主要规格与电气参数

  • 标称稳压值(Vz,nominal):6.8V
  • 稳压值允许范围:6.46V ~ 7.14V(典型生产公差)
  • 反向电流(Ir):500 nA @ 3.5 V(测量条件下的反向漏电)
  • 耗散功率(Pd):500 mW(最大功耗,须考虑散热与布局)
  • 稳态阻抗(Zzt):约 30 Ω(影响小信号纹波抑制能力)
  • 器件类型:独立式稳压二极管(单个芯片,非阵列)
  • 封装:SOD-123(小型表贴封装,焊接便捷)

说明:Pd 为器件在规定温度下的最大耗散功率,实际电流应按 Pd 与工作电压(Vz)计算最大允许电流 Iz_max ≈ Pd / Vz,理论值约 73.5 mA(500 mW / 6.8 V),但实际应用中应考虑热阻与温升、焊盘散热等因素进行留余设计。

三、主要特性与优势

  • 小型表贴封装(SOD-123),适合高密度电路板设计。
  • 低反向漏电(在指定电压下仅数百纳安级),适用于精密电路与低电流待机场景。
  • 中等稳态阻抗(≈30 Ω),对瞬态电流有一定抑制作用,适合去除小幅纹波与提供参考电压。
  • 额定耗散 500 mW,可胜任小功率稳压与钳位任务。
  • 独立器件,便于替换与单点保护设计。

四、典型应用场景

  • 低功耗微控制器供电稳压或参考电压源(配合限流电阻)。
  • 信号线过压保护与钳位(限制突发尖峰电压)。
  • 测试与测量电路中的基准或保护元件。
  • 电源管理小电流回路、传感器接口的稳压/保护。

五、封装与热管理建议

SOD-123 为小型表贴封装,热容小,热阻相对偏高。使用建议:

  • 在 PCB 设计时为 SOD-123 增加合适的铜箔面积以改善散热,尤其在接近最大 Pd 的情况下。
  • 若长期工作在较高散逸功率,应进行功耗降额(derating),并考虑在器件周围留出热传导路径或使用散热铜箔。
  • 对焊盘和过孔布局进行优化以便将热量传导到内层或底层大面积铜箔。

六、典型使用建议与电路示例

  • 基本稳压电路:将 BZT52C6V8 反向并联在负载两端,通过上游限流电阻 R 控制电流。计算公式:R = (Vin - Vz) / (Iz + Iload)。
  • 示例计算:若 Vin = 12V,希望通过齐氏稳压器提供约 6.8V 输出且工作电流(负载)为 5 mA,选择 Iz 约 5–10 mA 辅助稳压,则 R ≈ (12 − 6.8) / (10 + 5) mA ≈ 347 Ω(按实际标准值选择且留余)。
  • 为了延长器件寿命并保证温度稳定性,常将工作电流保持在最大允许电流的 30%–50% 范围内,避免长期在 Pd 临界值附近运行。

七、可靠性与选型注意事项

  • 在高温或连续大电流场合应谨慎,参考厂方完整数据手册确认热阻、最大结温和温度系数。
  • 若电路对稳压精度要求较高,应注意 Zzt 对小信号阻抗的影响,必要时选择低阻抗或更高功耗等级的器件。
  • 订购时确认批次与生产商(MDD)信息,必要时索取样品或完全规格书验证关键参数。

八、订购与替代建议

BZT52C6V8(MDD,SOD-123)适合作为 6.8V 级别的小功率稳压与保护元件。若需更高功率或者更低动态阻抗,可考虑更高 Pd 或不同封装的稳压二极管。最终选型建议参照完整器件数据手册并在目标温度与负载条件下进行实测验证。

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