WMSIC Electronic Components

MDD MDD2302

ModelMDD2302
PackageSOT23
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD MDD2302
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
MDD2302
Electronic Component
1
Package
SOT23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264462414
Operating Temperature
50℃~+150℃
Power Dissipation(Pd)
1.25W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
20V
Capacitor(Ciss)
340pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MDD2302 产品概述

1. 概述

MDD2302 是一款高效能的N沟道场效应管(MOSFET),具有截止电压为20V和额定电流为4A的特性,旨在满足现代电子设备对高效率和小型化的需求。该器件采用SOT-23封装,适合用于空间受限的应用场合。凭借其低导通电阻(25mΩ@4.5V),MDD2302在高频开关和电源管理等领域表现优秀。

2. 产品特点

  • 低导通电阻:MDD2302在4.5V的栅极驱动下,导通电阻为25mΩ,这意味着在高电流应用中,能够显著减少功率损耗,提升整体效率。
  • 紧凑封装:SOT-23封装尺寸小,适合于需要高密度组件布局的电子电路设计,特别适合便携设备和消费电子产品。
  • 高电流承载能力:该MOSFET最大连续电流为4A,能够适应多种负载应用场景,尤其是在电源管理模块中。
  • 广泛应用:适用于开关电源、升降压转换器、电机驱动和其他需要快速开关的低压应用。

3. 应用领域

MDD2302广泛应用于以下几个领域:

  • 开关电源(SMPS):由于其高效率和低导通电阻,MDD2302可被用于开关电源中的开关元件,从而提高整个电源系统的性能。
  • 电机驱动:在电机控制领域,它可以作为功率开关,帮助实现高效的电机驱动系统。
  • 消费电子产品:例如在智能手机、平板和其他小型电子设备中,MDD2302的紧凑封装使其成为理想的选择。
  • LED驱动电路:在LED驱动应用中,该MOSFET能够有效控制电流,提升LED的亮度与使用寿命。
  • 电池管理系统:在电池充电和保护电路中,MDD2302的高效性能有助于延长电池的使用寿命与安全性。

4. 典型应用电路

在一个简单的开关电源设计中,MDD2302可以作为主开关元件使用。通过控制栅极信号,MOSFET可以快速打开和关闭,从而控制电流的流动,达到稳定输出电压的目的。此外,通过合理的散热管理和布局,MDD2302可以确保在高负荷条件下安全可靠地运行。

5. 关键技术参数

  • 类型:N沟道MOSFET
  • 最大漏源电压(VDS):20V
  • 最大连续漏极电流(ID):4A
  • 导通电阻(RDS(on)):25mΩ @ VGS=4.5V
  • 工作温度范围:-55°C至+150°C

6. 采购信息

MDD2302可在全球各大电子元件分销商处采购。用户建议通过官方渠道获取最新的数据手册,以确保设计的规范性和产品的可靠性。

7. 结论

MDD2302是一款兼具高效率和低功耗的N沟道MOSFET,适合于多种现代电子应用。凭借其小巧的SOT-23封装和出色的电性能,它是实现高效开关和电源管理解决方案的理想选择。不论是用于消费类产品还是工业应用,MDD2302都能够提供稳定、可靠的性能,是工程师和设计师的优秀选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.