Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD DSF1J
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- MDD DSF1J
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- DSF1J
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0265729135
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSF1J 通用整流二极管产品概述
一、产品基本信息
DSF1J是MDD品牌推出的通用型整流二极管，采用表面贴装式封装SOD-123FL，专为中小功率电子设备的整流、续流及保护场景设计。该产品以平衡的电气性能、紧凑封装及宽环境适应性，成为消费电子、工业控制等领域的常用器件。
二、关键电气参数详解
DSF1J的核心参数围绕整流应用的关键需求优化，具体如下：
- 正向压降（Vf）：典型值1.68V（@1A正向电流），较低的导通压降可减少整流损耗，提升电源转换效率；
- 直流反向耐压（Vr）：额定值600V，满足220VAC市电（峰值约311V）整流的余量需求，同时覆盖部分高压小功率场景；
- 连续整流电流（If）：额定值1A，适配中小功率负载（如12V/1A电源模块）；
- 反向漏电流（Ir）：典型值5μA（@600V反向电压），低漏电流可降低待机功耗，提升电路稳定性；
- 非重复峰值浪涌电流（Ifsm）：30A（单次脉冲），具备一定浪涌耐受能力，应对电源启动瞬间的电流冲击；
- 工作结温范围：-55℃~+150℃，宽温范围支持极端环境（户外设备、工业高温场景）下稳定工作。
三、封装与物理特性
DSF1J采用SOD-123FL封装，属于表面贴装技术（SMT）封装，具有以下特点：
- 尺寸紧凑：封装尺寸约3.0mm（长）×2.5mm（宽）×1.1mm（高），相比传统插件封装节省约70% PCB空间，适合高密度电路设计；
- 贴装便捷：兼容自动化贴装生产线，实现高速批量生产，降低组装成本；
- 热性能可靠：低热阻设计配合150℃最高结温，有效散发布尔热效应热量，保障长时间工作稳定性。
四、典型应用场景
结合参数特性，DSF1J的典型应用包括：
- 中小功率电源整流：小家电（电饭煲、电水壶）AC-DC转换、LED驱动电源整流桥；
- 续流二极管：开关电源、DC-DC转换器中续流电感储能，避免开关管关断电压尖峰；
- 反向保护电路：电池供电设备防止反接损坏；
- 信号钳位：模拟电路限制信号峰值，保护后级器件；
- 工业控制模块：小型PLC辅助电源、传感器供电电路。
五、产品优势总结
DSF1J的核心优势在于性能平衡与场景适配性：
- 低正向压降+低反向漏电流，兼顾效率与待机功耗；
- 600V耐压+30A浪涌能力，满足市电及瞬态冲击需求；
- 宽结温范围+紧凑封装，适配多样环境与高密度设计；
- MDD品牌可靠性保障，适合量产应用。
该产品可作为通用整流二极管的替代选择，广泛应用于消费电子、工业、低功耗汽车电子等领域。
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