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产品简介
LESD3Z5.0C 是一款由 MDD 品牌推出的高性能 ESD(静电放电)保护二极管,专为静电和浪涌保护设计。该器件采用 SOD-323 封装,具有紧凑的尺寸和优异的电气性能,适用于各种需要高可靠性静电保护的电子设备。其核心功能是保护敏感电子元件免受静电放电(ESD)和瞬态电压事件(如浪涌)的损害,确保系统的稳定性和可靠性。
关键特性
击穿电压:7.8V
LESD3Z5.0C 的击穿电压为 7.8V,这意味着当电压超过此值时,二极管会迅速导通,将过电压引导至地,从而保护后续电路。
反向截止电压 (Vrwm):5V
该器件的反向截止电压为 5V,表明在正常工作条件下,二极管能够承受的最大反向电压为 5V,确保在正常电压范围内不会误动作。
反向漏电流 (Ir):1uA
在反向截止电压下,LESD3Z5.0C 的反向漏电流仅为 1uA,表现出极低的功耗和高效的能量管理能力。
峰值脉冲功率 (Ppp):60W
该器件能够承受高达 60W 的峰值脉冲功率,适用于处理高能量的瞬态电压事件,如雷击或电源浪涌。
峰值脉冲电流 (Ipp):5A
LESD3Z5.0C 的峰值脉冲电流为 5A,表明其能够快速响应并分流大电流,有效保护电路免受损坏。
最大钳位电压:12V
在瞬态事件发生时,该器件的最大钳位电压为 12V,确保后续电路不会暴露在过高的电压下,从而避免损坏。
工作温度范围:-55℃ ~ +150℃
LESD3Z5.0C 具有宽广的工作温度范围,能够在极端环境下稳定工作,适用于工业、汽车和消费电子等多种应用场景。
应用领域
LESD3Z5.0C 广泛应用于需要高可靠性静电保护的领域,包括但不限于:
封装与尺寸
LESD3Z5.0C 采用 SOD-323 封装,这是一种小型表面贴装封装,尺寸紧凑,适合高密度 PCB 设计。其封装尺寸为 1.7mm x 1.25mm x 0.95mm,能够在有限的空间内实现高效的静电保护。
品牌与质量保证
MDD 是一家知名的半导体器件制造商,以其高质量和可靠性著称。LESD3Z5.0C 经过严格的质量控制和测试,确保其在各种应用场景中的稳定性和耐用性。
总结
LESD3Z5.0C 是一款高性能的 ESD 保护二极管,具有优异的电气性能和紧凑的封装设计。其高击穿电压、低反向漏电流、高峰值脉冲功率和宽广的工作温度范围,使其成为保护敏感电子元件的理想选择。无论是消费电子、工业设备、汽车电子还是通信设备,LESD3Z5.0C 都能提供可靠的静电和浪涌保护,确保系统的长期稳定运行。
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