WMSIC Electronic Components

MDD LESD3Z5.0C

ModelLESD3Z5.0C
PackageSOD-323
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD LESD3Z5.0C
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
LESD3Z5.0C
Electronic Component
1
Package
SOD-323
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.026g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
18pF
Electronic Component
BM0265676088
Operating Temperature
55℃~+150℃
Voltage
12V
Electronic Component
IEC 61000-4-2;IEC 61000-4-4
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LESD3Z5.0C 产品概述

产品简介
LESD3Z5.0C 是一款由 MDD 品牌推出的高性能 ESD(静电放电)保护二极管,专为静电和浪涌保护设计。该器件采用 SOD-323 封装,具有紧凑的尺寸和优异的电气性能,适用于各种需要高可靠性静电保护的电子设备。其核心功能是保护敏感电子元件免受静电放电(ESD)和瞬态电压事件(如浪涌)的损害,确保系统的稳定性和可靠性。

关键特性

  1. 击穿电压:7.8V
    LESD3Z5.0C 的击穿电压为 7.8V,这意味着当电压超过此值时,二极管会迅速导通,将过电压引导至地,从而保护后续电路。

  2. 反向截止电压 (Vrwm):5V
    该器件的反向截止电压为 5V,表明在正常工作条件下,二极管能够承受的最大反向电压为 5V,确保在正常电压范围内不会误动作。

  3. 反向漏电流 (Ir):1uA
    在反向截止电压下,LESD3Z5.0C 的反向漏电流仅为 1uA,表现出极低的功耗和高效的能量管理能力。

  4. 峰值脉冲功率 (Ppp):60W
    该器件能够承受高达 60W 的峰值脉冲功率,适用于处理高能量的瞬态电压事件,如雷击或电源浪涌。

  5. 峰值脉冲电流 (Ipp):5A
    LESD3Z5.0C 的峰值脉冲电流为 5A,表明其能够快速响应并分流大电流,有效保护电路免受损坏。

  6. 最大钳位电压:12V
    在瞬态事件发生时,该器件的最大钳位电压为 12V,确保后续电路不会暴露在过高的电压下,从而避免损坏。

  7. 工作温度范围:-55℃ ~ +150℃
    LESD3Z5.0C 具有宽广的工作温度范围,能够在极端环境下稳定工作,适用于工业、汽车和消费电子等多种应用场景。

应用领域
LESD3Z5.0C 广泛应用于需要高可靠性静电保护的领域,包括但不限于:

  • 消费电子产品:如智能手机、平板电脑、笔记本电脑等,保护 USB、HDMI、音频接口等易受 ESD 影响的端口。
  • 工业设备:用于 PLC、传感器、通信模块等,确保设备在恶劣工业环境中的稳定运行。
  • 汽车电子:保护车载通信系统、娱乐系统和控制单元免受静电和浪涌的损害。
  • 通信设备:用于路由器、交换机、基站等,保护高速数据接口免受瞬态电压的干扰。

封装与尺寸
LESD3Z5.0C 采用 SOD-323 封装,这是一种小型表面贴装封装,尺寸紧凑,适合高密度 PCB 设计。其封装尺寸为 1.7mm x 1.25mm x 0.95mm,能够在有限的空间内实现高效的静电保护。

品牌与质量保证
MDD 是一家知名的半导体器件制造商,以其高质量和可靠性著称。LESD3Z5.0C 经过严格的质量控制和测试,确保其在各种应用场景中的稳定性和耐用性。

总结
LESD3Z5.0C 是一款高性能的 ESD 保护二极管,具有优异的电气性能和紧凑的封装设计。其高击穿电压、低反向漏电流、高峰值脉冲功率和宽广的工作温度范围,使其成为保护敏感电子元件的理想选择。无论是消费电子、工业设备、汽车电子还是通信设备,LESD3Z5.0C 都能提供可靠的静电和浪涌保护,确保系统的长期稳定运行。

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